Issued Patents All Time
Showing 76–100 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6468388 | Reactor chamber for an externally excited torroidal plasma source with a gas distribution plate | Hiroji Hanawa, Kenneth S. Collins, Kartik Ramaswamy, Andrew Nguyen, Tsutomu Tanaka | 2002-10-22 |
| 6458516 | Method of etching dielectric layers using a removable hardmask | Pavel Ionov, Allen Zhao, Peter Hsieh, Diana Xiaobing Ma, Chun Yan +1 more | 2002-10-01 |
| 6453842 | Externally excited torroidal plasma source using a gas distribution plate | Hiroji Hanawa, Kenneth S. Collins, Kartik Ramaswamy, Andrew Nguyen, Tsutomu Tanaka | 2002-09-24 |
| 6455431 | NH3 plasma descumming and resist stripping in semiconductor applications | Chang-Lin Hsieh, Hui Chen, Jie Yuan | 2002-09-24 |
| 6410449 | Method of processing a workpiece using an externally excited torroidal plasma source | Hiroji Hanawa, Kenneth S. Collins, Kartik Ramaswamy, Andrew Nguyen, Tsutomu Tanaka | 2002-06-25 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Ashok Sinha, Zheng Xu, Liang Chen, Roderick C. Mosely +3 more | 2002-04-16 |
| 6352049 | Plasma assisted processing chamber with separate control of species density | Gerald Yin, Arnold Kolandenko, Hong Ching Shan, Peter Loewenhardt, Chii Guang Lee +9 more | 2002-03-05 |
| 6352081 | Method of cleaning a semiconductor device processing chamber after a copper etch process | Danny Lu, Allen Zhao, Peter Hsieh, Hong Shih, Li Xu | 2002-03-05 |
| 6348126 | Externally excited torroidal plasma source | Hiroji Hanawa, Kenneth S. Collins, Kartik Ramaswamy, Andrew Nguyen, Tsutomu Tanaka | 2002-02-19 |
| 6331380 | Method of pattern etching a low K dielectric layer | Pavel Ionov, Allen Zhao, Peter Hsieh, Diana Xiaobing Ma, Chun Yan +1 more | 2001-12-18 |
| 6312554 | Apparatus and method for controlling the ratio of reactive to non-reactive ions in a semiconductor wafer processing chamber | — | 2001-11-06 |
| 6296780 | System and method for etching organic anti-reflective coating from a substrate | Chun Yan, Diana Xiaobing Ma | 2001-10-02 |
| 6277251 | Apparatus and method for shielding a dielectric member to allow for stable power transmission into a plasma processing chamber | Jeng H. Hwang, Steve S. Y. Mak | 2001-08-21 |
| 6270687 | RF plasma method | Donald Olgado, Avi Tepman, Diana Xiaobing Ma, Gerald Yin, Peter Loewenhardt +2 more | 2001-08-07 |
| 6251217 | Reticle adapter for a reactive ion etch system | Richard W. Plavidal | 2001-06-26 |
| 6178920 | Plasma reactor with internal inductive antenna capable of generating helicon wave | Allan D'Ambra, Yeuk-Fai Edwin Mok, Richard E. Remington, James E. Sammons, III | 2001-01-30 |
| 6158384 | Plasma reactor with multiple small internal inductive antennas | Allan D'Ambra, Yeuk-Fai Edwin Mok, Richard E. Remmington, James E. Sammons, III | 2000-12-12 |
| 6153530 | Post-etch treatment of plasma-etched feature surfaces to prevent corrosion | Xiaoye Zhao, Chang-Lin Hsieh, Xian-Can Deng, Wen-Chiang Tu, Chung-Fu Chu +1 more | 2000-11-28 |
| 6143476 | Method for high temperature etching of patterned layers using an organic mask stack | Allen Zhao, Peter Hsieh, Diana Xiaobing Ma | 2000-11-07 |
| 6080529 | Method of etching patterned layers useful as masking during subsequent etching or for damascene structures | Pavel Ionov, Allen Zhao, Peter Hsieh, Diana Xiaobing Ma, Chun Yan +1 more | 2000-06-27 |
| 6071372 | RF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls | Donald Olgado, Avi Tepman, Diana Xiaobing Ma, Gerald Yin, Peter Loewenhardt +2 more | 2000-06-06 |
| 6020686 | Inductively and multi-capacitively coupled plasma reactor | Hiroji Hanawa, Diana Xiaobing Ma, Gerald Yin | 2000-02-01 |
| 6010603 | Patterned copper etch for micron and submicron features, using enhanced physical bombardment | Diana Xiaobing Ma, Gerald Yin | 2000-01-04 |
| 6008140 | Copper etch using HCI and HBr chemistry | Allen Zhao, Xiancan Deng, Diana Xiaobing Ma | 1999-12-28 |
| 5968847 | Process for copper etch back | Diana Xiaobing Ma | 1999-10-19 |