Issued Patents All Time
Showing 51–75 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283345 | Methods for pre-cleaning conductive materials on a substrate | Xiangjin Xie, Feng Q. Liu, Daping Yao, Alexander Jansen, Joung Joo Lee +2 more | 2019-05-07 |
| 10157787 | Method and apparatus for depositing cobalt in a feature | Jin-Hee Park, Tae Hong Ha, Sang-Hyeob Lee, Thomas Jongwan Kwon, Jaesoo Ahn +2 more | 2018-12-18 |
| 10109481 | Aluminum-nitride buffer and active layers by physical vapor deposition | Mingwei Zhu, Nag B. Patibandla, Rongjun Wang, Vivek Agrawal, Anantha K. Subramani +1 more | 2018-10-23 |
| 10109520 | Methods for depositing dielectric barrier layers and aluminum containing etch stop layers | Sree Rangasai V. Kesapragada, Kevin Moraes, Srinivas Guggilla, He Ren, Mehul Naik +6 more | 2018-10-23 |
| 10096455 | Extended dark space shield | Thanh X. Nguyen, Rongjun Wang, Muhammad M. Rasheed | 2018-10-09 |
| 10096725 | Method for graded anti-reflective coatings by physical vapor deposition | Yong Cao, Daniel Lee Diehl, Rongjun Wang, TAI-CHOU PAPO CHEN, Tingjun Xu | 2018-10-09 |
| 10060024 | Sputtering target for PVD chamber | Zhendong Liu, Rongjun Wang, Srinivas Gandikota, Tza-Jing Gung, Muhammad M. Rasheed | 2018-08-28 |
| 10047430 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2018-08-14 |
| 10043670 | Systems and methods for low resistivity physical vapor deposition of a tungsten film | Jothilingam Ramalingam, Thanh X. Nguyen, Zhiyong Wang, Jianxin Lei | 2018-08-07 |
| 10014179 | Methods for forming cobalt-copper selective fill for an interconnect | Rong Tao, Tae Hong Ha, Joung Joo Lee | 2018-07-03 |
| 9984976 | Interconnect structures and methods of formation | Yana Cheng, Yong Cao, Srinivas Guggilla, Sree Rangasai V. Kesapragada, Deenesh Padhi | 2018-05-29 |
| 9953813 | Methods and apparatus for improved metal ion filtering | Joung Joo Lee, Guojun Liu | 2018-04-24 |
| 9834840 | Process kit shield for improved particle reduction | Muhammad M. Rasheed, Rongjun Wang, Zhendong Liu, Xinyu Fu | 2017-12-05 |
| 9812328 | Methods for forming low resistivity interconnects | Kaushal K. Singh, Er-Xuan Ping, Sundar Ramamurthy, Randhir P. S. Thakur | 2017-11-07 |
| 9752228 | Sputtering target for PVD chamber | Zhendong Liu, Rongjun Wang, Srinivas Gandikota, Tza-Jing Gung, Muhammad M. Rasheed | 2017-09-05 |
| 9633824 | Target for PVD sputtering system | Thanh X. Nguyen, Yong Cao, Muhammad M. Rasheed | 2017-04-25 |
| 9633839 | Methods for depositing dielectric films via physical vapor deposition processes | Weimin Zeng, Thanh X. Nguyen, Yana Cheng, Yong Cao, Daniel Lee Diehl +2 more | 2017-04-25 |
| 9499901 | High density TiN RF/DC PVD deposition with stress tuning | Yong Cao, Adolph Miller Allen, Tza-Jing Gung | 2016-11-22 |
| 9460959 | Methods for pre-cleaning conductive interconnect structures | Xiangjin Xie, Feng Q. Liu, Daping Yao, Alexander Jansen, Joung Joo Lee +2 more | 2016-10-04 |
| 9396933 | PVD buffer layers for LED fabrication | Mingwei Zhu, Rongjun Wang, Nag B. Patibandia, Vivek Agrawal, Cheng-Hsiung Tsai +5 more | 2016-07-19 |
| 9373485 | Apparatus and method for improved darkspace gap design in RF sputtering chamber | John C. Forster | 2016-06-21 |
| 9281167 | Variable radius dual magnetron | Thanh X. Nguyen, Rongjun Wang, Muhammad M. Rasheed | 2016-03-08 |
| 9162930 | PVD ALN film with oxygen doping for a low etch rate hardmask film | Yong Cao, Kazuya Daito, Rajkumar Jakkaraju | 2015-10-20 |
| 9062372 | Self-ionized and capacitively-coupled plasma for sputtering and resputtering | Praburam Gopalraja, Jianming Fu, John C. Forster, Umesh M. Kelkar | 2015-06-23 |
| 9017533 | Apparatus for controlling radial distribution of plasma ion density and ion energy at a workpiece surface by multi-frequency RF impedance tuning | John C. Forster, Daniel J. Hoffman, John Pipitone, Rongjun Wang | 2015-04-28 |