Issued Patents All Time
Showing 76–97 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8992741 | Method for ultra-uniform sputter deposition using simultaneous RF and DC power on target | Rongjun Wang, Zhendong Liu, Tza-Jing Gung, Maurice E. Ewert | 2015-03-31 |
| 8992747 | Apparatus and method for improved darkspace gap design in RF sputtering chamber | John C. Forster | 2015-03-31 |
| 8895450 | Low resistivity tungsten PVD with enhanced ionization and RF power coupling | Yong Cao, Srinivas Gandikota, Wei Wang, Zhendong Liu, Kevin Moraes +3 more | 2014-11-25 |
| 8841211 | Methods for forming interconnect structures | Joung Joo Lee, Tza-Jing Gung | 2014-09-23 |
| 8764961 | Cu surface plasma treatment to improve gapfill window | Qian Luo, Arvind Sundarrajan, Hua Chung, Jick Yu, Murali Narasimhan | 2014-07-01 |
| 8696875 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-04-15 |
| 8668816 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-03-11 |
| 8637390 | Metal gate structures and methods for forming thereof | Seshadri Ganguli, Sang Ho Yu, Sang-Hyeob Lee, Hyoung-Chan Ha, Wei Ti Lee +4 more | 2014-01-28 |
| 8580094 | Magnetron design for RF/DC physical vapor deposition | Rongjun Wang, Sally S. Lou, Muhammad M. Rasheed, Jianxin Lei, Srinivas Gandikota +4 more | 2013-11-12 |
| 8557094 | Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum | Hua Chung, Rongjun Wang, Tza-Jing Gung, Praburam Gopalraja, Jick Yu +1 more | 2013-10-15 |
| 8558299 | Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming | Yong Cao, Srinivas Gandikota, Wei Wang, Zhendong Liu, Kevin Moraes +3 more | 2013-10-15 |
| 8435392 | Encapsulated sputtering target | Lara Hawrylchak, Vijay Parhke, Rongjun Wang | 2013-05-07 |
| 8133368 | Encapsulated sputtering target | Lara Hawrylchak, Vijay Parhke, Rongjun Wang | 2012-03-13 |
| 8129280 | Substrate device having a tuned work function and methods of forming thereof | Rongjun Wang, Dengliang Yang, Zhendong Liu, Srinivas Gandikota | 2012-03-06 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Zheng Xu, Hong Mei Zhang, Praburam Gopalraja, Suraj Rengarajan +7 more | 2010-03-30 |
| 7659204 | Oxidized barrier layer | Hua Chung, Rongjun Wang, Praburam Gopalraja, Jick Yu, Jenn-Yue Wang | 2010-02-09 |
| 7569125 | Shields usable with an inductively coupled plasma reactor | Tza-Jing Gung, John C. Forster, Peijun Ding, Marc Schweitzer, Keith A. Miller +1 more | 2009-08-04 |
| 7504006 | Self-ionized and capacitively-coupled plasma for sputtering and resputtering | Praburam Gopalraja, Jianming Fu, John C. Forster, Umesh M. Kelkar | 2009-03-17 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Praburam Gopalraja, Suraj Rengarajan +7 more | 2007-08-07 |
| 7041201 | Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith | Tza-Jing Gung, John C. Forster, Peijun Ding, Marc Schweitzer, Keith A. Miller +1 more | 2006-05-09 |
| 6911124 | Method of depositing a TaN seed layer | Praburam Gopalraja, Suraj Rengarajan, John C. Forster, Jianming Fu, Peijun Ding | 2005-06-28 |
| 6887786 | Method and apparatus for forming a barrier layer on a substrate | Hong Mei Zhang, Praburam Gopalraja, John C. Forster, Jick Yu | 2005-05-03 |