Issued Patents All Time
Showing 101–125 of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7405481 | Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip | Keng-Chu Lin, Shwang-Ming Cheng | 2008-07-29 |
| 7312531 | Semiconductor device and fabrication method thereof | Hui-Lin Chang, Chung-Chi Ko, Pi-Tsung Chen, Shau-Lin Shue, Chien-Hsueh Shih +2 more | 2007-12-25 |
| 7259090 | Copper damascene integration scheme for improved barrier layers | Zhen-Cheng Wu | 2007-08-21 |
| 7256124 | Method of fabricating semiconductor device | Keng-Chu Lin, Yi-Chi Liao, Hung Chun Tsai, Hung-Wen Su | 2007-08-14 |
| 7253524 | Copper interconnects | Zhen-Cheng Wu, Tzu-Jen Chou, Weng Chang, Syun-Ming Jang, Mong-Song Liang | 2007-08-07 |
| 7250364 | Semiconductor devices with composite etch stop layers and methods of fabrication thereof | Tien-I Bao, Su-Hong Lin, Syun-Ming Jang | 2007-07-31 |
| 7247571 | Method for planarizing semiconductor structures | Ying-Tsung Chen, Zhen-Cheng Wu, Pi-Tsung Chen | 2007-07-24 |
| 7244673 | Integration film scheme for copper / low-k interconnect | Tai-Chun Huang, Chih-Hsiang Yao, Yih-Hsiung Lin, Tien-I Bao, Bi-Trong Chen | 2007-07-17 |
| 7220677 | WAT process to avoid wiring defects | Lin Li, Wen-Chih Chiou, Chih-Hsien Lin | 2007-05-22 |
| 7217648 | Post-ESL porogen burn-out for copper ELK integration | Ying-Tsung Chen, Zhen-Cheng Wu, Pi-Tsung Chen | 2007-05-15 |
| 7160821 | Method of depositing low k films | Tzu-Fang Huang, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2007-01-09 |
| 7129164 | Method for forming a multi-layer low-K dual damascene | Hui-Lin Chang, Li Li, Tien-I Bao, Chih-Hsien Lin | 2006-10-31 |
| 7094683 | Dual damascene method for ultra low K dielectrics | Chen-Nan Yeh | 2006-08-22 |
| 7074708 | Method of decreasing the k value in sioc layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2006-07-11 |
| 7074727 | Process for improving dielectric properties in low-k organosilicate dielectric material | Peng-Fu Hsu, Jyu-Horng Shieh, Hun-Jan Tao, Yuan-Hung Chiu | 2006-07-11 |
| 7071093 | Integrated treatment method for obtaining robust low dielectric constant materials | Mong-Song Liang, Huilin Chang | 2006-07-04 |
| 7056826 | Method of forming copper interconnects | Zhen-Cheng Wu, Ying-Tsung Chen, Syun-Ming Jang | 2006-06-06 |
| 6958524 | Insulating layer having graded densification | Lih-Ping Li | 2005-10-25 |
| 6930061 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2005-08-16 |
| 6869896 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2005-03-22 |
| 6806207 | Method of depositing low K films | Tzu-Fang Huang, Li-Qun Xia, Ellie Yieh, Wai-Fan Yau, David Cheung +5 more | 2004-10-19 |
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2004-08-31 |
| 6756321 | Method for forming a capping layer over a low-k dielectric with improved adhesion and reduced dielectric constant | Chung-Chi Ko, Lain-Jong Li, Lih-Ping Li, Yu-Huei Chen, Shu E Ku | 2004-06-29 |
| 6753607 | Structure for improving interlevel conductor connections | Zhen-Cheng Wu, Syun-Ming Jang | 2004-06-22 |
| 6743737 | Method of improving moisture resistance of low dielectric constant films | Wai-Fan Yau, David Cheung, Nasreen Chopra, Robert P. Mandal, Farhad Moghadam | 2004-06-01 |