Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7564136 | Integration scheme for Cu/low-k interconnects | Ming-Ling Yeh, Chen-Hua Yu, Keng-Chu Lin, Tien-I Bao | 2009-07-21 |
| 7405481 | Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip | Keng-Chu Lin, Yung-Cheng Lu | 2008-07-29 |
| 7314828 | Repairing method for low-k dielectric materials | Keng-Chu Lin, Chen-Hua Yu, Ching-Ya Wang, Chia-Cheng Chou, Tien-I Bao | 2008-01-01 |
| 7160800 | Decreasing metal-silicide oxidation during wafer queue time | Zhen-Cheng Wu, Cheng-Hung Chang, Yu-Lien Huang | 2007-01-09 |
| 7135402 | Sealing pores of low-k dielectrics using CxHy | Keng-Chu Lin, Ming-Ling Yeh, Tien-I Bao | 2006-11-14 |
| 7115974 | Silicon oxycarbide and silicon carbonitride based materials for MOS devices | Zhen-Cheng Wu, Hung Chun Tsai, Da-Wen Lin, Weng Chang, Mong-Song Liang | 2006-10-03 |