Issued Patents All Time
Showing 76–100 of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9136226 | Impurity doped UV protection layer | Zhen-Cheng Wu, Chung-Chi Ko | 2015-09-15 |
| 8999842 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Syun-Ming Jang | 2015-04-07 |
| 8987085 | Methods for improving uniformity of cap layers | Chen-Hua Yu, Ming-Shih Yeh, Chih-Hsien Lin, Hui-Lin Chang | 2015-03-24 |
| 8785324 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Syun-Ming Jang | 2014-07-22 |
| 8330275 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Syun-Ming Jang | 2012-12-11 |
| 8324731 | Integrated circuit device | Chen-Hua Yu, Shwang-Ming Jeng, Huilin Chang, Ting-Yu Shen, Yichi Liao | 2012-12-04 |
| 8264046 | Synergy effect of alloying materials in interconnect structures | Hui-Lin Chang, Syun-Ming Jang | 2012-09-11 |
| 8143162 | Interconnect structure having a silicide/germanide cap layer | Chen-Hua Yu, Hui-Lin Chang, Ting-Yu Shen, Hung Chun Tsai | 2012-03-27 |
| 8084328 | Semiconductor device including I/O oxide nitrided core oxide on substrate | Zhen-Cheng Wu, Pi-Tsung Chen, Ying-Tsung Chen | 2011-12-27 |
| 8053356 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Syun-Ming Jang | 2011-11-08 |
| 7977791 | Selective formation of boron-containing metal cap pre-layer | Hui-Lin Chang, Syun-Ming Jang | 2011-07-12 |
| 7897505 | Method for enhancing adhesion between layers in BEOL fabrication | Chung-Chi Ko, Lih-Ping Li, Hui-Lin Chang, Chih-Hsien Lin | 2011-03-01 |
| 7863196 | Self-aligned dielectric cap | Hulin Chang, Syun-Ming Jang | 2011-01-04 |
| 7834458 | Interconnect structure for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Syun-Ming Jang | 2010-11-16 |
| 7834405 | Semiconductor device including I/O oxide and nitrided core oxide on substrate | Zhen-Cheng Wu, Pi-Tsung Chen, Ying-Tsung Chen | 2010-11-16 |
| 7732923 | Impurity doped UV protection layer | Zhen-Cheng Wu, Chung-Chi Ko | 2010-06-08 |
| 7723226 | Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio | Chen-Hua Yu, Pei-Ren Jeng, Chia-Cheng Chou, Keng-Chu Lin, Chung-Chi Ko +2 more | 2010-05-25 |
| 7655556 | Interconnect structures for semiconductor devices | Hui-Lin Chang, Hung Chun Tsai, Syun-Ming Jang | 2010-02-02 |
| 7646097 | Bond pads and methods for fabricating the same | Chen-Hua Yu, Shwang-Ming Jeng, Huilin Chang, Ting-Yu Shen, Yichi Liao | 2010-01-12 |
| 7642189 | Synergy effect of alloying materials in interconnect structures | Hui-Lin Chang, Syun-Ming Jang | 2010-01-05 |
| 7638859 | Interconnects with harmonized stress and methods for fabricating the same | Ming-Hsing Tsai | 2009-12-29 |
| 7629273 | Method for modulating stresses of a contact etch stop layer | Chen-Hua Yu, Hung Chun Tsai, Hui-Lin Chang, Ting-Yu Shen | 2009-12-08 |
| 7560377 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu +5 more | 2009-07-14 |
| 7456093 | Method for improving a semiconductor device delamination resistance | Pi-Tsung Chen, Keng-Chu Lin, Hui-Lin Chang, Lih-Ping Li, Tien-I Bao +1 more | 2008-11-25 |
| 7446047 | Metal structure with sidewall passivation and method | Minghsing Tsai | 2008-11-04 |