Issued Patents All Time
Showing 51–75 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11432372 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2022-08-30 |
| 11417698 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang | 2022-08-16 |
| 11355471 | System for processing semiconductor devices | Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2022-06-07 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2022-05-24 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Hao-Jan Pei +1 more | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Chih-Hua Chen +4 more | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2022-02-08 |
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Ching-Hua Hsieh, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11121089 | Integrated circuit package and method | Jen-Jui Yu, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Ching-Hua Hsieh | 2021-09-14 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-08-24 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2021-07-20 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2021-06-29 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2021-06-01 |
| 11002927 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang +2 more | 2021-01-26 |
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10867976 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2020-12-15 |
| 10868353 | Electronic device and manufacturing method thereof | Chun-Lin Lu, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen +8 more | 2020-12-15 |
| 10840199 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2020-11-17 |
| 10790261 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2020-09-29 |
| 10784221 | Method of processing solder bump by vacuum annealing | Chung-Shi Liu, Ming-Da Cheng, Chung-Cheng Lin, Yu-Peng Tsai, Cheng-Ting Chen | 2020-09-22 |
| 10784203 | Semiconductor package and method | Tzu-Sung Huang, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2020-09-22 |
| 10734263 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2020-08-04 |