Issued Patents All Time
Showing 26–50 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040309 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2024-07-16 |
| 12040283 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2024-07-16 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Chih-Hua Chen +4 more | 2024-06-11 |
| 11996400 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2024-05-28 |
| 11942451 | Semiconductor structure and method of forming the same | Mao-Yen Chang, Yu-Chia Lai, Cheng-Shiuan Wong, Ting Hao Kuo, Ching-Hua Hsieh +2 more | 2024-03-26 |
| 11942464 | Semiconductor package and method | Hao-Jan Pei, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2024-03-26 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2024-02-13 |
| 11894332 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2024-02-06 |
| 11874513 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2024-01-16 |
| 11862577 | Package structure and method of fabricating the same | Hao-Jan Pei, Ching-Hua Hsieh, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao +2 more | 2024-01-02 |
| 11830781 | Package structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2023-11-28 |
| 11830746 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more | 2023-11-28 |
| 11791192 | Workpiece holder, wafer chuck, wafer holding method | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2023-10-17 |
| 11749535 | Semiconductor bonding structures and methods | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2023-09-05 |
| 11721659 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2023-08-08 |
| 11664325 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2023-05-30 |
| 11664300 | Fan-out packages and methods of forming the same | Chih-Chiang Tsao, Chao-Wei Chiu, Hsuan-Ting Kuo, Chia-Lun Chang, Cheng-Shiuan Wong +1 more | 2023-05-30 |
| 11646293 | Semiconductor structure and method | Chia-Shen Cheng, Wei-Yu Chen, Philip Yu-Shuan Chung, Ching-Hua Hsieh, Chen-Hua Yu | 2023-05-09 |
| 11640935 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +7 more | 2023-05-02 |
| 11610859 | Reflow method and system | Cheng-Shiuan Wong, Ching-Hua Hsieh, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen +2 more | 2023-03-21 |
| 11585992 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsuan-Ting Kuo, Chia-Shen Cheng +1 more | 2023-02-21 |
| 11515274 | Semiconductor package and manufacturing method thereof | Fang-Yu Liang, Kai-Chiang Wu, Chih-Chiang Tsao | 2022-11-29 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2022-10-25 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2022-10-04 |