Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658323 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-05-19 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |
| 10535644 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2020-01-14 |
| 10515915 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-12-24 |
| 10512124 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2019-12-17 |
| 10510734 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-12-17 |
| 10475679 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-11-12 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10297579 | Package on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2019-05-21 |
| 10276548 | Semiconductor packages having dummy connectors and methods of forming same | Chen-Shien Chen, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su +2 more | 2019-04-30 |
| 10276536 | Structure and formation method of chip package with fan-out structure | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2019-04-30 |
| 10269739 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2019-04-23 |
| 10157862 | Integrated fan-out package and method of fabricating the same | Wei-Yu Chen, Ching-Hua Hsieh, Chung-Shi Liu, Chia-Lun Chang | 2018-12-18 |
| 10153180 | Semiconductor bonding structures and methods | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2018-12-11 |
| 10141281 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2018-11-27 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10109612 | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices | Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2018-10-23 |
| 10074615 | Package structure and method of fabricating the same | Ying-Cheng Tseng, Chih-Hua Chen, Hao-Yi Tsai, Kuo-Chung Yee, Chia-Hung Liu | 2018-09-11 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-05-22 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9935044 | Semiconductor packaging and manufacturing method thereof | Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2018-04-03 |
| 9935067 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2018-04-03 |
| 9929071 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2018-03-27 |
| 9911633 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-03-06 |