Issued Patents All Time
Showing 126–136 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8901726 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2014-12-02 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Bor-Ping Jang, Chung-Shi Liu +7 more | 2014-11-11 |
| 8853002 | Methods for metal bump die assembly | Ai-Tee Ang, Yu-Jen Tseng, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2014-10-07 |
| 8735273 | Forming wafer-level chip scale package structures with reduced number of seed layers | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Yi-Wen Wu, Chung-Shi Liu +2 more | 2014-05-27 |
| 8716737 | Die-bonded LED | Jian-Shian Lin, Shau-Yi Chen, Chieh-Lung Lai | 2014-05-06 |
| 8674496 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2014-03-18 |
| 8501615 | Metal bump formation | Ming-Da Cheng, Chih-Wei Lin, Tzong-Hann Yang, Wen-Hsiung Lu, Zheng-Yi Lim +2 more | 2013-08-06 |
| 8440503 | Methods for performing reflow in bonding processes | Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2013-05-14 |
| 8242011 | Method of forming metal pillar | Zheng-Yi Lim, Yi-Wen Wu, Wen-Hsiung Lu, Chih-Wei Lin, Tzong-Huann Yang +2 more | 2012-08-14 |
| 8236687 | Die-bonding method of LED chip and LED manufactured by the same | Jian-Shian Lin, Shau-Yi Chen, Chieh-Lung Lai | 2012-08-07 |
| 8235551 | LED module and packaging method thereof | Jian-Shian Lin, Chieh-Lung Lai, Weng-Jung Lu, Yi-Ping Huang, Ya-Chun Tu | 2012-08-07 |