Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9888527 | Systems for processing semiconductor devices, and methods of processing semiconductor devices | Wei-Yu Chen, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2018-02-06 |
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2018-01-30 |
| 9881903 | Package-on-package structure with epoxy flux residue | Chen-Hua Yu, Wei-Yu Chen, Kuei-Wei Huang, Ming-Da Cheng, Ching-Hua Hsieh +2 more | 2018-01-30 |
| 9768137 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9627369 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9607921 | Package on package interconnect structure | Wen-Hsiung Lu, Yi-Wen Wu, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-28 |
| 9570410 | Methods of forming connector pad structures, interconnect structures, and structures thereof | Chia-Lun Chang, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen | 2017-02-14 |
| 9536865 | Interconnection joints having variable volumes in package structures and methods of formation thereof | Hsuan-Ting Kuo, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng, Wei-Yu Chen +1 more | 2017-01-03 |
| 9538582 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2017-01-03 |
| 9524956 | Integrated fan-out structure and method | Hao-Jan Pei, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-12-20 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Meng-Tse Chen, Hui-Min Huang +2 more | 2016-11-29 |
| 9484227 | Dicing in wafer level package | Chia-Shen Cheng, An-Jhih Su, Chung-Shi Liu, Hsien-Wei Chen, Ming-Da Cheng +1 more | 2016-11-01 |
| 9427818 | Semiconductor processing boat design with pressure sensor | Ai-Tee Ang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-30 |
| 9425157 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2016-08-23 |
| 9412717 | Apparatus and methods for molded underfills in flip chip packaging | Meng-Tse Chen, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9412723 | Package on-package structures and methods for forming the same | Kuei-Wei Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9373603 | Reflow process and tool | Ai-Tee Ang, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-06-21 |
| 9355927 | Semiconductor packaging and manufacturing method thereof | Wen-Hsiung Lu, Cheng-Ting Chen, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-05-31 |
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2016-05-03 |
| 9281288 | System and method for fine pitch PoP structure | Cheng-Chung Lin, Cheng-Ting Chen, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-03-08 |
| 9263412 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Wei-Yu Chen, Kuei-Wei Huang | 2016-02-16 |
| 9230935 | Package on package structure and method of manufacturing the same | Chun-Cheng Lin, Cheng-Ting Chen, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-01-05 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen +7 more | 2015-07-14 |
| 9030022 | Packages and methods for forming the same | Meng-Tse Chen, Chun-Cheng Lin, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2015-05-12 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang +6 more | 2015-01-06 |