Issued Patents All Time
Showing 25 most recent of 215 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431430 | Technologies for high throughput additive manufacturing for integrated circuit components | Yoshihiro Tomita, Feras Eid, Adel A. Elsherbini, Wenhao Li, Stephen L. Morein | 2025-09-30 |
| 12424719 | Compact surface transmission line waveguides with vertical ground planes | Telesphor Kamgaing, Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong | 2025-09-23 |
| 12424716 | RF filters and multiplexers manufactured in the core of a package substrate using glass core technology | Neelam Prabhu Gaunkar, Veronica Strong, Georgios Dogiamis, Telesphor Kamgaing | 2025-09-23 |
| 12381182 | Direct bonding in microelectronic assemblies | Feras Eid, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2025-08-05 |
| 12368091 | Package substrate with glass core having vertical power planes for improved power delivery | Telesphor Kamgaing, Veronica Strong, Georgios Dogiamis, Neelam Prabhu Gaunkar | 2025-07-22 |
| 12354992 | First layer interconnect first on carrier approach for EMIB patch | Changhua Liu, Xiaoying Guo, Steve Cho, Leonel Arana, Robert Alan May +1 more | 2025-07-08 |
| 12349282 | Capacitors in through glass vias | Benjamin Duong, Helme A. CASTRO DE LA TORRE, Kristof Darmawikarta, Darko Grujicic, Sashi S. Kandanur +5 more | 2025-07-01 |
| 12347761 | Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate | Neelam Prabhu Gaunkar, Georgios Dogiamis, Telesphor Kamgaing, Veronica Strong, Johanna M. Swan | 2025-07-01 |
| 12327775 | Thermal performance in hybrid bonded 3D die stacks | Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Julien Sebot | 2025-06-10 |
| 12288751 | Microelectronic assemblies | Johanna M. Swan | 2025-04-29 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more | 2025-04-01 |
| 12261097 | Thermal management in integrated circuit packages | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2025-03-25 |
| 12255225 | Low leakage thin film capacitors using titanium oxide dielectric with conducting noble metal oxide electrodes | Thomas L. Sounart, Kaan Oguz, Neelam Prabhu Gaunkar, Henning Braunisch, I-Cheng Tung | 2025-03-18 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Jeremy Ecton, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more | 2025-03-18 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more | 2025-03-04 |
| 12218069 | Multi-chip package with high density interconnects | Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2025-02-04 |
| 12205902 | High-density interconnects for integrated circuit packages | Veronica Strong, Henning Braunisch, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2025-01-21 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Mohammad Enamul Kabir +3 more | 2025-01-14 |
| 12183961 | Methods for conductively coating millimeter waveguides | Georgios Dogiamis, Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff +3 more | 2024-12-31 |
| 12176223 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan | 2024-12-24 |
| 12176323 | Microelectronic assemblies | Adel A. Elsherbini, Henning Braunisch, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more | 2024-12-24 |
| 12165962 | Hermetic sealing structures in microelectronic assemblies having direct bonding | Mohammad Enamul Kabir, Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Feras Eid | 2024-12-10 |
| 12165994 | Radio frequency antennas and waveguides for communication between integrated circuit devices | Kristof Darmawikarta, Benjamin Duong, Telesphor Kamgaing, Miranda Ngan, Srinivas V. Pietambaram | 2024-12-10 |
| 12155372 | Multi-filter die | Georgios Dogiamis, Feras Eid, Telesphor Kamgaing, Johanna M. Swan | 2024-11-26 |
| 12155133 | Microelectronic devices designed with mold patterning to create package-level components for high frequency communication systems | Feras Eid, Sasha N. Oster, Telesphor Kamgaing, Georgios Dogiamis | 2024-11-26 |