Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798865 | Nested architectures for enhanced heterogeneous integration | Debendra Mallik, Sujit Sharan, Digvijay A. Raorane | 2023-10-24 |
| 11756856 | Package architecture including thermoelectric cooler structures | Krishna Vasanth Valavala, Chandra Mohan Jha, Kelly Lofgreen, Weihua Tang | 2023-09-12 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Robert L. Sankman | 2023-09-12 |
| 11749577 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Digvijay A. Raorane | 2023-09-05 |
| 11742293 | Multiple die package using an embedded bridge connecting dies | Yidnekachew S. Mekonnen, Kemel Aygun, Christopher S. Baldwin, Rajasekaran Swaminathan | 2023-08-29 |
| 11742261 | Nested architectures for enhanced heterogeneous integration | Debendra Mallik, Sujit Sharan, Digvijay A. Raorane | 2023-08-29 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-08-22 |
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2023-07-18 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Robert L. Sankman | 2023-07-04 |
| 11664293 | Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios | Krishna Vasanth Valavala, Chandra Mohan Jha | 2023-05-30 |
| 11595045 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Gregg William Baeckler | 2023-02-28 |
| 11587851 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Digvijay A. Raorane, Paul R. Start | 2023-02-21 |
| 11581235 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Digvijay A. Raorane | 2023-02-14 |
| 11569173 | Bridge hub tiling architecture | Andrew Collins, Digvijay A. Raorane, Wilfred Gomes, Sujit Sharan | 2023-01-31 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Debendra Mallik +7 more | 2023-01-17 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |
| 11417630 | Semiconductor package having passive support wafer | Debendra Mallik, Digvijay A. Raorane, Mitul Modi | 2022-08-16 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Robert L. Sankman, James C. Matayabas, Jr., Ken Hackenberg, Nayandeep K. Mahanta +1 more | 2022-08-02 |
| 11328968 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2022-05-10 |
| 11257804 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Wesley D. Mc Cullough | 2022-02-22 |
| 11222847 | Enabling long interconnect bridges | Zhiguo Qian, Henning Braunisch, Kemal Aygun, Sujit Sharan | 2022-01-11 |
| 11217573 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more | 2022-01-04 |
| 11070209 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Gregg William Baeckler | 2021-07-20 |
| 11049798 | Embedded bridge with through-silicon Vias | Aditya S. Vaidya, Digvijay A. Raorane, Paul R. Start | 2021-06-29 |
| 11031288 | Passive components in vias in a stacked integrated circuit package | Sujit Sharan, Stefan Rusu, Donald S. Gardner | 2021-06-08 |