Issued Patents All Time
Showing 51–75 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011448 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Digvijay A. Raorane | 2021-05-18 |
| 10978423 | Projecting contacts and method for making the same | Dae-Woo Kim, Sujit Sharan | 2021-04-13 |
| 10804117 | Method to enable interposer to interposer connection | Digvijay A. Raorane | 2020-10-13 |
| 10685947 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Robert L. Sankman, Wesley D. Mc Cullough | 2020-06-16 |
| 10601426 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Gregg William Baeckler | 2020-03-24 |
| 10595409 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, John S. Guzek, Nitin A. Deshpande | 2020-03-17 |
| 10468331 | Heat management system | Je-Young Chang, Jae Whan Kim, Blake Rogers, Devdatta P. Kulkarni | 2019-11-05 |
| 10373893 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Digvijay A. Raorane, Paul R. Start | 2019-08-06 |
| 10366951 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2019-07-30 |
| 10236209 | Passive components in vias in a stacked integrated circuit package | Sujit Sharan, Stefan Rusu, Donald S. Gardner | 2019-03-19 |
| 10068852 | Integrated circuit package with embedded bridge | Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2018-09-04 |
| 9847308 | Magnetic intermetallic compound interconnect | Rajasekaran Swaminathan | 2017-12-19 |
| 9775763 | Adaptive exoskeleton, control system and methods using the same | Aleksandar Aleksov, Brian S. Doyle | 2017-10-03 |
| 9716067 | Integrated circuit package with embedded bridge | Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2017-07-25 |
| 9713255 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, John S. Guzek, Nitin A. Deshpande | 2017-07-18 |
| 9691711 | Method of making an electromagnetic interference shield for semiconductor chip packages | John S. Guzek, Adel A. Elsherbini, Nitin A. Deshpande | 2017-06-27 |
| 9685421 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Omkar G. Karhade, Nitin A. Deshpande | 2017-06-20 |
| 9679843 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni | 2017-06-13 |
| 9548410 | Photovoltaic window | Aleksandar Aleksov, Brian S. Doyle | 2017-01-17 |
| 9526285 | Flexible computing fabric | Aleksandar Aleksov, Sairam Agraharam, Ian A. Young, John C. Johnson, Debendra Mallik +1 more | 2016-12-27 |
| 9368455 | Electromagnetic interference shield for semiconductor chip packages | John S. Guzek, Adel A. Elsherbini, Nitin A. Deshpande | 2016-06-14 |
| 9323327 | System and method for providing tactile feedback | Aleksandar Aleksov, Brian S. Doyle | 2016-04-26 |
| 9275955 | Integrated circuit package with embedded bridge | Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2016-03-01 |
| 9118188 | Wireless charging system | Brian S. Doyle, Aleksandar Aleksov | 2015-08-25 |
| 9076882 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Omkar G. Karhade, Nitin A. Deshpande | 2015-07-07 |