Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8524596 | Techniques for improving bond pad performance | Frederic Beaulieu, Gobinda Das, Steven J. Duda, Matthew J. Farinelli, Adreanne Kelly +1 more | 2013-09-03 |
| 8450168 | Ferro-electric capacitor modules, methods of manufacture and design structures | Jeffrey P. Gambino, Matthew D. Moon, James S. Nakos, Paul William Pastel, Brett A. Philips | 2013-05-28 |
| 8395196 | Hydrogen barrier liner for ferro-electric random access memory (FRAM) chip | Brian M. Czabaj, James V. Hart, III, James S. Nakos | 2013-03-12 |
| 8230586 | Method of cooling a resistor | Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis +1 more | 2012-07-31 |
| 8157970 | Sputtering target fixture | David C. Strippe | 2012-04-17 |
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, Timothy D. Sullivan +2 more | 2011-12-27 |
| 8052799 | By-product collecting processes for cleaning processes | Edward C. Cooney, III, Anthony K. Stamper, David C. Strippe | 2011-11-08 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, Timothy D. Sullivan +2 more | 2011-08-23 |
| 7994895 | Heat sink for integrated circuit devices | Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis +1 more | 2011-08-09 |
| 7879716 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Keith E. Downes, Thomas L. McDevitt | 2011-02-01 |
| 7843039 | Stress-modified device structures, methods of fabricating such stress-modified device structures, and design structures for an integrated circuit | Edward C. Cooney, III, Mark D. Dupuis, Steven S. Williams | 2010-11-30 |
| 7687867 | Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme | Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Vidhya Ramachandran | 2010-03-30 |
| 7662722 | Air gap under on-chip passive device | Anthony K. Stamper, Anil K. Chinthakindi, Douglas D. Coolbaugh, Timothy J. Dalton, Daniel C. Edelstein +3 more | 2010-02-16 |
| 7485210 | Sputtering target fixture | David C. Strippe | 2009-02-03 |
| 7310036 | Heat sink for integrated circuit devices | Douglas D. Coolbaugh, Ebenezer E. Eshun, Terence B. Hook, Robert M. Rassel, Edmund J. Sprogis +1 more | 2007-12-18 |
| 7282404 | Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme | Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Vidhya Ramachandran | 2007-10-16 |
| 7235487 | Metal seed layer deposition | Steven P. Barkyoumb, Jonathan D. Chapple-Sokol, Edward C. Cooney, III, Keith E. Downes, Thomas L. McDevitt | 2007-06-26 |
| 7166904 | Structure and method for local resistor element in integrated circuit technology | Jason P. Gill, Terence B. Hook, Randy W. Mann, William R. Tonti, Steven H. Voldman | 2007-01-23 |
| 7056820 | Bond pad | Stephen Cole, Barbara Waterhouse | 2006-06-06 |
| 7052925 | Method for manufacturing self-compensating resistors within an integrated circuit | Edmund J. Sprogis, Anthony K. Stamper, Erick G. Walton | 2006-05-30 |
| 6900505 | Method of forming refractory metal contact in an opening, and resulting structure | Jonanthan D. Chapple-Sokol, Randy W. Mann, Jed H. Rankin, Daniel S. Vanslette | 2005-05-31 |
| 6882052 | Plasma enhanced liner | — | 2005-04-19 |
| 6838364 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Stephen Bruce Brodsky, Matthew J. Rutten, David C. Strippe, Daniel S. Vanslette | 2005-01-04 |
| 6793735 | Integrated cobalt silicide process for semiconductor devices | Marc W. Cantell, Jerome B. Lasky, Ronald J. Line, Kirk D. Peterson, Prabhat Tiwari | 2004-09-21 |
| 6762121 | Method of forming refractory metal contact in an opening, and resulting structure | Jonathan D. Chapple-Sokol, Randy W. Mann, Jed H. Rankin, Daniel S. Vanslette | 2004-07-13 |