Issued Patents All Time
Showing 126–150 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6569707 | Method for improving performance of organic semiconductors in bottom electrode structure | Christos D. Dimitrakopoulos, Ioannis Kymissis | 2003-05-27 |
| 6555762 | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | Bernd Karl Appelt, Jeffrey D. Gelorme, Sung Kwon Kang, Voya R. Markovich, Kostas Papathomas | 2003-04-29 |
| 6537908 | Method for dual-damascence patterning of low-k interconnects using spin-on distributed hardmask | Ann R. Fornof, Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Christy S. Tyberg | 2003-03-25 |
| 6500604 | Method for patterning sensitive organic thin films | Christos D. Dimitrakopoulos, Ioannis Kymissis | 2002-12-31 |
| 6451712 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Kenneth P. Rodbell +1 more | 2002-09-17 |
| 6448655 | Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation | Katherina Babich, Alessandro C. Callegari, Stephen A. Cohen, Alfred Grill, Christopher V. Jahnes +2 more | 2002-09-10 |
| 6413852 | Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material | Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca +2 more | 2002-07-02 |
| 6344660 | Thin-film field-effect transistor with organic semiconductor requiring low operating voltages | Christos D. Dimitrakopoulos, Peter Richard Duncombe, Bruce K. Furman, Robert Benjamin Laibowitz, Deborah A. Neumayer | 2002-02-05 |
| 6337522 | Structure employing electrically conductive adhesives | Sung Kwon Kang | 2002-01-08 |
| 6335539 | Method for improving performance of organic semiconductors in bottom electrode structure | Christos D. Dimitrakopoulos, Ioannis Kymissis | 2002-01-01 |
| 6322685 | Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom | Sung Kwon Kang | 2001-11-27 |
| 6300164 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Kathleen A. Stalter | 2001-10-09 |
| 6297559 | Structure, materials, and applications of ball grid array interconnections | Anson J. Call, Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Kathleen A. Stalter | 2001-10-02 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2001-08-28 |
| 6255671 | Metal embedded passivation layer structure for microelectronic interconnect formation, customization and repair | Nestor A. Bojarczuk, Supratik Guha, Arunava Gupta | 2001-07-03 |
| 6238599 | High conductivity, high strength, lead-free, low cost, electrically conducting materials and applications | Jeffrey D. Gelorme, Sung Kwon Kang | 2001-05-29 |
| 6224690 | Flip-Chip interconnections using lead-free solders | Panayotis Andricacos, Madhav Datta, Hariklia Deligianni, Wilma Jean Horkans, Sung Kwon Kang +4 more | 2001-05-01 |
| 6207472 | Low temperature thin film transistor fabrication | Alessandro C. Callegari, Christos D. Dimitrakopoulos | 2001-03-27 |
| 6203926 | Corrosion-free multi-layer conductor | Umar M. Ahmad, Harsaran S. Bhatia, Satya Pal Singh Bhatia, Hormazdyar M. Dalal, William H. Price | 2001-03-20 |
| 6184121 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Leena Paivikki Buchwalter, Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, John P. Hummel +3 more | 2001-02-06 |
| 6177975 | Precision alignment of plates | Stephen L. Buchwalter, David Lewis, Shui-Chih Lien, John J. Ritsko | 2001-01-23 |
| 6120885 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Stephen A. DeLaurentis, Shaji Farooq, Sung Kwon Kang, Kathleen A. Stalter | 2000-09-19 |
| 6114413 | Thermally conducting materials and applications for microelectronic packaging | Sung Kwon Kang, Eva E. Simonyi | 2000-09-05 |
| 6104466 | Precision alignment of plates | Stephen L. Buchwalter, David Lewis, Shui-Chih Lien, John J. Ritsko | 2000-08-15 |
| 6059952 | Method of fabricating coated powder materials and their use for high conductivity paste applications | Sung Kwon Kang, Rajinder S. Rai | 2000-05-09 |