SP

Sampath Purushothaman

IBM: 183 patents #194 of 70,183Top 1%
AM AMD: 2 patents #3,994 of 9,279Top 45%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
📍 Yorktown Heights, NY: #11 of 858 inventorsTop 2%
🗺 New York: #171 of 115,490 inventorsTop 1%
Overall (All Time): #3,902 of 4,157,543Top 1%
187
Patents All Time

Issued Patents All Time

Showing 101–125 of 187 patents

Patent #TitleCo-InventorsDate
6831364 Method for forming a porous dielectric material layer in a semiconductor device and device formed Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Kenneth P. Rodbell +1 more 2004-12-14
6819000 High density area array solder microjoining interconnect structure and fabrication method John Harold Magerlein, Kevin S. Petrarca, Carlos J. Sambucetti, Richard P. Volant, George F. Walker 2004-11-16
6815329 Multilayer interconnect structure containing air gaps and method for making Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Jeffrey Hedrick +4 more 2004-11-09
6784485 Diffusion barrier layer and semiconductor device containing same Stephan A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Lynne M. Gignac +5 more 2004-08-31
6780499 Ordered two-phase dielectric film, and semiconductor device containing the same Stephen M. Gates, Christopher B. Murray, Satyanarayana V. Nitta 2004-08-24
6759321 Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation Katherina Babich, Alessandro C. Callegari, Stephen A. Cohen, Alfred Grill, Christopher V. Jahnes +2 more 2004-07-06
6747472 Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same John Harold Magerlein, Samuel McKnight, Kevin S. Petrarca, Carlos J. Sambucetti, Joseph J. Van Horn +2 more 2004-06-08
6737725 Multilevel interconnect structure containing air gaps and method for making Alfred Grill, Jeffrey Hedrick, Christopher V. Jahnes, Satyanarayana V. Nitta, Kevin S. Petrarca +2 more 2004-05-18
6732908 High density raised stud microjoining system and methods of fabricating the same Bruce K. Furman, Maheswaran Surendra, Sherif A. Goma, Simon Karecki, John Harold Magerlein +4 more 2004-05-11
6726996 Laminated diffusion barrier Edward Barth, Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates +3 more 2004-04-27
6724069 Spin-on cap layer, and semiconductor device containing same Timothy J. Dalton, Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Christy S. Tyberg 2004-04-20
6720249 Protective hardmask for producing interconnect structures Timothy J. Dalton, Christopher V. Jahnes, Joyce C. Liu 2004-04-13
6716742 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg 2004-04-06
6710450 Interconnect structure with precise conductor resistance and method to form same Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg 2004-03-23
6682786 Liquid crystal display cell having liquid crystal molecules in vertical or substantially vertical alignment Shui-Chih Lien, Alessandro C. Callegari, Paul S. Andry, Praveen Chaudhari, James A. Lacey +6 more 2004-01-27
6678949 Process for forming a multi-level thin-film electronic packaging structure Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more 2004-01-20
6677680 Hybrid low-k interconnect structure comprised of 2 spin-on dielectric materials Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg 2004-01-13
6661098 High density area array solder microjoining interconnect structure and fabrication method John Harold Magerlein, Kevin S. Petrarca, Carlos J. Sambucetti, Richard P. Volant, George F. Walker 2003-12-09
6657305 Semiconductor recessed mask interconnect technology Stephen A. Cohen, Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Brian Herbst +1 more 2003-12-02
6646355 Structure comprising beam leads bonded with electrically conductive adhesive Sung Kwon Kang 2003-11-11
6641899 Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same Matthew E. Colburn, Stephen M. Gates, Jeffrey Hedrick, Elbert E. Huang, Satyanarayana V. Nitta +1 more 2003-11-04
6632314 Method of making a lamination and surface planarization for multilayer thin film interconnect RongQing Yu, Kimberley A. Kelly, Chandrika Prasad, Sung Kwon Kang 2003-10-14
6603204 Low-k interconnect structure comprised of a multilayer of spin-on porous dielectrics Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg 2003-08-05
6583847 Self alignment of substrates by magnetic alignment Alessandro C. Callegari, Praveen Chaudhari, James P. Doyle, Eileen A. Galligan, James A. Lacey +3 more 2003-06-24
6577011 Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same Leena Paivikki Buchwalter, Alessandro C. Callegari, Stephan A. Cohen, Teresita O. Graham, John P. Hummel +3 more 2003-06-10