Issued Patents All Time
Showing 76–100 of 187 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2009-09-22 |
| 7545671 | Static random access memory cell with improved stability | Azeez Bhavnagarwala, Stephen V. Kosonocky, Kenneth P. Rodbell | 2009-06-09 |
| 7517637 | Method of producing self-aligned mask in conjunction with blocking mask, articles produced by same and composition for same | Matthew E. Colburn, Satyanarayana V. Nitta | 2009-04-14 |
| 7485341 | Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same | Matthew E. Colburn, Stephen M. Gates, Jeffrey Hedrick, Elbert E. Huang, Satyanarayana V. Nitta +1 more | 2009-02-03 |
| 7467742 | Electrically conducting adhesives for via fill applications | Jeffrey D. Gelorme, Sung Kwon Kang, Konstantinos I. Papathomas | 2008-12-23 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2008-07-29 |
| 7397691 | Static random access memory cell with improved stability | Azeez Bhavnagarwala, Stephen V. Kosonocky, Kenneth P. Rodbell | 2008-07-08 |
| 7393776 | Method of forming closed air gap interconnects and structures formed thereby | Matthew E. Colburn, Timothy J. Dalton, Elbert E. Huang, Satya V. Nitta, Katherine L. Saenger +2 more | 2008-07-01 |
| 7371684 | Process for preparing electronics structures using a sacrificial multilayer hardmask scheme | Matthew E. Colburn, Ricardo A. Donaton, Conal E. Murray, Satyanarayana V. Nitta, Sujatha Sankaran +2 more | 2008-05-13 |
| 7361991 | Closed air gap interconnect structure | Simon Karecki, Maheswaran Surendra, Satya V. Nitta, Matthew E. Colburn, Timothy J. Dalton +2 more | 2008-04-22 |
| 7309649 | Method of forming closed air gap interconnects and structures formed thereby | Simon Karecki, Timothy J. Dalton, Elbert E. Huang, Satya V. Nitta, Katherine L. Saenger +2 more | 2007-12-18 |
| 7268432 | Interconnect structures with engineered dielectrics with nanocolumnar porosity | Matthew E. Colburn, Satya V. Nitta, Charles T. Black, Kathryn Guarini | 2007-09-11 |
| 7179758 | Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics | Nirupama Chakrapani, Matthew E. Colburn, Christos D. Dimitrakopoulos, Dirk Pfeiffer, Satyanarayana V. Nitta | 2007-02-20 |
| 7098476 | Multilayer interconnect structure containing air gaps and method for making | Katherina Babich, Roy A. Carruthers, Timothy J. Dalton, Alfred Grill, Jeffrey Hedrick +4 more | 2006-08-29 |
| 7084479 | Line level air gaps | Shyng-Tsong Chen, Stefanie Chiras, Matthew E. Colburn, Timothy J. Dalton, Jeffrey Hedrick +9 more | 2006-08-01 |
| 7045453 | Very low effective dielectric constant interconnect structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Mahadevaiyer Krishnan, Satya V. Nitta +1 more | 2006-05-16 |
| 7037744 | Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby | Matthew E. Colburn, Satyanarayana V. Nitta | 2006-05-02 |
| 7030495 | Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby | Matthew E. Colburn, Satyanarayana V. Nitta | 2006-04-18 |
| 7030481 | High density chip carrier with integrated passive devices | Michael P. Chudzik, Robert H. Dennard, Rama Divakaruni, Bruce K. Furman, Rajarao Jammy +3 more | 2006-04-18 |
| 7023093 | Very low effective dielectric constant interconnect Structures and methods for fabricating the same | Donald F. Canaperi, Timothy J. Dalton, Stephen M. Gates, Mahadevaiyer Krishnan, Satya V. Nitta +1 more | 2006-04-04 |
| 6962872 | High density chip carrier with integrated passive devices | Michael P. Chudzik, Robert H. Dennard, Rama Divakaruni, Bruce K. Furman, Rajarao Jammy +3 more | 2005-11-08 |
| 6943451 | Semiconductor devices containing a discontinuous cap layer and methods for forming same | Stanley Joseph Whitehair, Stephen M. Gates, Satyanarayana V. Nitta, Maurice McGlashan-Powell, Kevin S. Petrarca | 2005-09-13 |
| 6930034 | Robust ultra-low k interconnect structures using bridge-then-metallization fabrication sequence | Matthew E. Colburn, Elbert E. Huang, Satyanarayana V. Nitta, Katherine L. Saenger | 2005-08-16 |
| 6911400 | Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same | Matthew E. Colburn, Stephen M. Gates, Jeffrey Hedrick, Elbert E. Huang, Satyanarayana V. Nitta +1 more | 2005-06-28 |
| 6831366 | Interconnects containing first and second porous low-k dielectrics separated by a porous buried etch stop layer | Stephen M. Gates, Jeffrey Hedrick, Satyanarayana V. Nitta, Cristy Sensenich Tyberg | 2004-12-14 |