SP

Sampath Purushothaman

IBM: 183 patents #194 of 70,183Top 1%
AM AMD: 2 patents #3,994 of 9,279Top 45%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
📍 Yorktown Heights, NY: #11 of 858 inventorsTop 2%
🗺 New York: #171 of 115,490 inventorsTop 1%
Overall (All Time): #3,902 of 4,157,543Top 1%
187
Patents All Time

Issued Patents All Time

Showing 151–175 of 187 patents

Patent #TitleCo-InventorsDate
6061114 Alignment of liquid crystal layers Alessandro C. Callegari, Praveen Chaudhari, James P. Doyle, James A. Lacey, Shui-Chin Alan Lien +3 more 2000-05-09
6020946 Dry processing for liquid-crystal displays using low energy ion bombardment Alessandro C. Callegari, Praveen Chaudhari, James P. Doyle, James A. Lacey, Shui-Chin Alan Lien +3 more 2000-02-01
6015509 Composition containing a polymer and conductive filler and use thereof Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more 2000-01-18
5997773 Method for providing discharge protection or shielding Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more 1999-12-07
5985458 Housing for electromagnetic interference shielding Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more 1999-11-16
5981970 Thin-film field-effect transistor with organic semiconductor requiring low operating voltages Christos D. Dimitrakopoulos, Peter Richard Duncombe, Bruce K. Furman, Robert Benjamin Laibowitz, Deborah A. Neumayer 1999-11-09
5958590 Dendritic powder materials for high conductivity paste applications Sung Kwon Kang, George F. Walker 1999-09-28
5946551 Fabrication of thin film effect transistor comprising an organic semiconductor and chemical solution deposited metal oxide gate dielectric Christos D. Dimitrakopoulos, Peter Richard Duncombe, Bruce K. Furman, Robert Benjamin Laibowitz, Deborah A. Neumayer 1999-08-31
5922466 Composite comprising a metal substrate and a corrosion protecting layer Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more 1999-07-13
5916486 Method for providing discharge protection or shielding Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more 1999-06-29
5855993 Electronic devices having metallurgies containing copper-semiconductor compounds Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more 1999-01-05
5837119 Methods of fabricating dendritic powder materials for high conductivity paste applications Sung Kwon Kang, George F. Walker 1998-11-17
5830332 Sputter deposition of hydrogenated amorphous carbon film and applications thereof Edward D. Babich, Alessandro C. Callegari, Fuad E. Doany 1998-11-03
5776587 Electronic package comprising a substrate and a semiconductor device bonded thereto Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more 1998-07-07
5700398 Composition containing a polymer and conductive filler and use thereof Marie Angelopoulos, Vlasta Brusic, Teresita O. Graham, Ravi F. Saraf, Jane M. Shaw +2 more 1997-12-23
5633047 Electronic devices having metallurgies containing copper-semiconductor compounds Michael John Brady, Curtis E. Farrell, Sung Kwon Kang, Jeffrey R. Marino, Donald Joseph Mikalsen +5 more 1997-05-27
5599582 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more 1997-02-04
5582858 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more 1996-12-10
5569501 Diamond-like carbon films from a hydrocarbon helium plasma Fredric D. Bailey, Douglas A. Buchanan, Alessandro C. Callegari, Howard M. Clearfield, Fuad E. Doany +8 more 1996-10-29
5569739 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Kang-Wook Lee, Terrence R. O'Toole, Jane M. Shaw, Alfred Viehbeck +1 more 1996-10-29
5534094 Method for fabricating multi-layer thin film structure having a separation layer Gnanalingam Arjavalingam, Alina Deutsch, Fuad E. Doany, Bruce K. Furman, Donald J. Hunt +7 more 1996-07-09
5532031 I/O pad adhesion layer for a ceramic substrate Shaji Farooq, Srinivasa S. N. Reddy, Vivek M. Sura 1996-07-02
5491610 Electronic package having active means to maintain its operating temperature constant Lawrence S. Mok, Bahgat Sammakia, Janusz S. Wilczynski, Tien Y. Wu 1996-02-13
5483105 Module input-output pad having stepped set-back Suryanarayana Kaja, Eric D. Perfecto, William H. Price, Srinivasa N. Reddy, Vivek M. Sura +1 more 1996-01-09
5470661 Diamond-like carbon films from a hydrocarbon helium plasma Fredric D. Bailey, Douglas A. Buchanan, Alessandro C. Callegari, Howard M. Clearfield, Fuad E. Doany +8 more 1995-11-28