SP

Sampath Purushothaman

IBM: 183 patents #194 of 70,183Top 1%
AM AMD: 2 patents #3,994 of 9,279Top 45%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
📍 Yorktown Heights, NY: #11 of 858 inventorsTop 2%
🗺 New York: #171 of 115,490 inventorsTop 1%
Overall (All Time): #3,902 of 4,157,543Top 1%
187
Patents All Time

Issued Patents All Time

Showing 176–187 of 187 patents

Patent #TitleCo-InventorsDate
5436412 Interconnect structure having improved metallization Umar M. Ahmad, Ananda H. Kumar, Eric D. Perfecto, Chandrika Prasad, Sudipta K. Ray 1995-07-25
5427983 Process for corrosion free multi-layer metal conductors Umar M. Ahmad, Harsaran S. Bhatia, Satya Pal Singh Bhatia, Hormazdyar M. Dalal, William H. Price 1995-06-27
5420073 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal Giulio DiGiacomo, Jung-Ihl Kim, Chandrasekhar Narayan 1995-05-30
5367195 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal Giulio DiGiacomo, Jung-Ihl Kim, Chandrasekhar Narayan 1994-11-22
5326643 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier Eleftherios Adamopoulos, Jungihl Kim, Kang-Wook Lee, Tae S. Oh, Terrence R. O'Toole +4 more 1994-07-05
5304284 Methods for etching a less reactive material in the presence of a more reactive material Rangarajan Jagannathan, Scott A. Sikorski 1994-04-19
5296189 Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith Sung Kwon Kang, John J. Ritsko, Jane M. Shaw, Subhash L. Shinde 1994-03-22
5258236 Multi-layer thin film structure and parallel processing method for fabricating same Gnanalingam Arjavalingam, Alina Deutsch, Fuad E. Doany, Bruce K. Furman, Donald J. Hunt +7 more 1993-11-02
5167913 Method of forming an adherent layer of metallurgy on a ceramic substrate John Acocella, Philip L. Flaitz, Raj N. Master, Chandrasekhar Narayan, Sarah H. Knickerbocker +2 more 1992-12-01
5074969 Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Ismail C. Noyan +2 more 1991-12-24
5038195 Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Ismail C. Noyan +2 more 1991-08-06
4985310 Multilayered metallurgical structure for an electronic component Birendra Agarwala, Keith F. Beckman, Alice H. Cooper-Joselow, Chandrasekhar Narayan, Sudipta K. Ray 1991-01-15