Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5831810 | Electronic component package with decoupling capacitors completely within die receiving cavity of substrate | Kenneth A. Bird, Peter J. Brofman, Francis F. Cappo, Jason L. Frankel, Suresh D. Kadakia +1 more | 1998-11-03 |
| 5304284 | Methods for etching a less reactive material in the presence of a more reactive material | Rangarajan Jagannathan, Sampath Purushothaman | 1994-04-19 |