Issued Patents All Time
Showing 326–350 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8003425 | Methods for forming anti-reflection structures for CMOS image sensors | James W. Adkisson, John J. Ellis-Monaghan, Charles F. Musante | 2011-08-23 |
| 8003428 | Method of forming an inverted lens in a semiconductor structure | Terence W. Barrett, Robert K. Leidy | 2011-08-23 |
| 7989312 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2011-08-02 |
| 7989358 | Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch | Timothy H. Daubenspeck, Jerome B. Lasky, Christopher D. Muzzy, Wolfgang Sauter | 2011-08-02 |
| 7985671 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2011-07-26 |
| 7964967 | High surface area aluminum bond pad for through-wafer connections to an electronic package | James W. Adkisson, Mark D. Jaffe, Richard J. Rassel, Edmund J. Sprogis | 2011-06-21 |
| 7960245 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Anthony K. Stamper | 2011-06-14 |
| 7958477 | Structure, failure analysis tool and method of determining white bump location using failure analysis tool | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman | 2011-06-07 |
| 7956412 | Lateral diffusion field effect transistor with a trench field plate | Natalie B. Feilchenfeld, Louis D. Lanzerotti, Benjamin T. Voegeli, Steven H. Voldman, Michael J. Zierak | 2011-06-07 |
| 7943428 | Bonded semiconductor substrate including a cooling mechanism | Anthony K. Stamper | 2011-05-17 |
| 7939390 | Gap capacitors for monitoring stress in solder balls in flip chip technology | Stephen P. Ayotte, Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-10 |
| 7939914 | Dual wired integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Anthony K. Stamper | 2011-05-10 |
| 7935408 | Substrate anchor structure and method | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-05-03 |
| 7935638 | Methods and structures for enhancing perimeter-to-surface area homogeneity | James A. Culp, John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin | 2011-05-03 |
| 7935604 | Method of making small geometry features | James W. Adkisson, Robert K. Leidy, Walter V. Lepuschenko, David Alan Meatyard, Stephen A. Mongeon +1 more | 2011-05-03 |
| 7928527 | Delamination and crack resistant image sensor structures and methods | Mark D. Jaffe, Robert K. Leidy, Charles F. Musante, Richard J. Rassel | 2011-04-19 |
| 7923840 | Electrically conductive path forming below barrier oxide layer and integrated circuit | Gregory Costrini, Ramachandra Divakaruni, Randy W. Mann | 2011-04-12 |
| 7915162 | Method of forming damascene filament wires | Brent A. Anderson, Andres Bryant, Anthony K. Stamper | 2011-03-29 |
| 7910408 | Damage propagation barrier and method of forming | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7911803 | Current distribution structure and method | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2011-03-22 |
| 7893468 | Optical sensor including stacked photodiodes | Daniel N. Maynard, Kevin N. Ogg, Richard J. Rassel, Raymond J. Rosner | 2011-02-22 |
| 7892926 | Fuse link structures using film stress for programming and methods of manufacture | Karl W. Barth, Tom C. Lee, Kevin S. Petrarca | 2011-02-22 |
| 7892940 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2011-02-22 |
| 7883916 | Optical sensor including stacked photosensitive diodes | Daniel N. Maynard, Kevin N. Ogg, Richard J. Rassel, Raymond J. Rosner | 2011-02-08 |
| 7886240 | Modifying layout of IC based on function of interconnect and related circuit and design structure | James W. Adkisson, Natalie B. Feilchenfeld, Howard S. Landis, Benjamin T. Voegeli, Steven H. Voldman +1 more | 2011-02-08 |