Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7115494 | Method and system for controlling the presence of fluorine in refractory metal layers | Ashok Sinha, Ming Xi, Moris Kori, Alfred Mak, Jeong Soo Byun +1 more | 2006-10-03 |
| 7112961 | Method and apparatus for dynamically measuring the thickness of an object | Siqing Lu, Yu-Chia Chang, Cecilia Martner, Quyen Pham, Yu Gu +3 more | 2006-09-26 |
| 7085616 | Atomic layer deposition apparatus | Barry Chin, Alfred Mak, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2006-08-01 |
| 7033922 | Method and system for controlling the presence of fluorine in refractory metal layers | Moris Kori, Alfred Mak, Jeong Soo Byun, Hua Chung, Ashok Sinha +1 more | 2006-04-25 |
| 6932871 | Multi-station deposition apparatus and method | Mei Chang, Walter Glenn | 2005-08-23 |
| 6866746 | Clamshell and small volume chamber with fixed substrate support | Alfred Mak, Gwo-Chuan Tzu, Avi Tepman, Ming Xi, Walter Glenn | 2005-03-15 |
| 6855368 | Method and system for controlling the presence of fluorine in refractory metal layers | Moris Kori, Alfred Mak, Jeong Soo Byun, Hua Chung | 2005-02-15 |
| 6827815 | Showerhead assembly for a processing chamber | Mark Hytros, Truc T. Tran, Hongbee Teoh, Avgerinos V. Gelatos, Salvador P. Umotoy | 2004-12-07 |
| 6793766 | Apparatus having platforms positioned for precise centering of semiconductor wafers during processing | Eric W. Schieve | 2004-09-21 |
| 6777352 | Variable flow deposition apparatus and method in semiconductor substrate processing | Avi Tepman | 2004-08-17 |
| 6729824 | Dual robot processing system | Moris Kori | 2004-05-04 |
| 6718126 | Apparatus and method for vaporizing solid precursor for CVD or atomic layer deposition | — | 2004-04-06 |
| 6603269 | Resonant chamber applicator for remote plasma source | Be Van Vo, Salvador P. Umotoy, Son Trinh, Sergio Edelstein, Avi Tepman +2 more | 2003-08-05 |
| 6589352 | Self aligning non contact shadow ring process kit | Joseph Yudovsky, Salvador P. Umotoy, Tom Madar, Girish Dixit, Gwo-Chuan Tzu | 2003-07-08 |
| 6551929 | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques | Moris Kori, Alfred Mak, Jeong Soo Byun, Hua Chung, Ashok Sinha +1 more | 2003-04-22 |
| 6517592 | Cold trap assembly | Salvador P. Umotoy, Russell C. Ellwanger, Ronald L. Rose, Joel M. Huston, James Jin-Long Chen | 2003-02-11 |
| 6503331 | Tungsten chamber with stationary heater | Joseph Yudovsky, Salvador P. Umotoy | 2003-01-07 |
| 6494955 | Ceramic substrate support | Sal Umotoy, Xiaoxiong Yuan, Anzhong Chang, Hongbee Teoh, Anh N. Nguyen +1 more | 2002-12-17 |
| 6436192 | Apparatus for aligning a wafer | Ling Chen, Joseph Yudovsky, Ying Yu | 2002-08-20 |
| 6430468 | Method and apparatus for accurate placement of semiconductor wafers onto respective platforms within a single reaction chamber | Avi Tepman | 2002-08-06 |
| 6375748 | Method and apparatus for preventing edge deposition | Joseph Yudovsky, Tom Madar, Salvador P. Umotoy, Son Trinh, Anzhong Chang +1 more | 2002-04-23 |
| 6374512 | Method for reducing contamination of a substrate in a substrate processing system | Xin Sheng Guo, Shin-Hung Li | 2002-04-23 |
| 6364954 | High temperature chemical vapor deposition chamber | Salvador P. Umotoy, Steve H. Chiao, Anh N. Nguyen, Be Van Vo, Joel M. Huston +1 more | 2002-04-02 |
| 6364949 | 300 mm CVD chamber design for metal-organic thin film deposition | David T. Or, Keith Kuang-Kuo Koai, Fufa Chen | 2002-04-02 |
| 6302965 | Dispersion plate for flowing vaporizes compounds used in chemical vapor deposition of films onto semiconductor surfaces | Salvador P. Umotoy, Vincent Ku, Xiaoxiong Yuan | 2001-10-16 |