| 7777483 |
Method and apparatus for measuring a thickness of a layer of a wafer |
Lawrence Chung-Lai Lei, Siqing Lu, Yu-Chia Chang, Cecilia Martner, Yu Gu +3 more |
2010-08-17 |
| 7355394 |
Apparatus and method of dynamically measuring thickness of a layer of a substrate |
Lawrence Chung-Lai Lei, Siqing Lu, Yu-Chia Chang, Cecilia Martner, Yu Gu +3 more |
2008-04-08 |
| 7112961 |
Method and apparatus for dynamically measuring the thickness of an object |
Lawrence Chung-Lai Lei, Siqing Lu, Yu-Chia Chang, Cecilia Martner, Yu Gu +3 more |
2006-09-26 |
| 6592817 |
Monitoring an effluent from a chamber |
Kenneth Tsai, Tung Bach |
2003-07-15 |
| 6271148 |
Method for improved remote microwave plasma source for use with substrate processing system |
Chien-Teh Kao, Kenneth Tsai, Ronald L. Rose, Calvin Augason, Joseph Yudovsky |
2001-08-07 |
| 6026762 |
Apparatus for improved remote microwave plasma source for use with substrate processing systems |
Chien-Teh Kao, Kenneth Tsai, Ronald L. Rose, Calvin Augason, Joseph Yudovsky |
2000-02-22 |
