Issued Patents All Time
Showing 26–50 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6991709 | Multi-step magnetron sputtering process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +1 more | 2006-01-31 |
| 6939804 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2005-09-06 |
| 6905737 | Method of delivering activated species for rapid cyclical deposition | Donald Verplancken | 2005-06-14 |
| 6893548 | Method of conditioning electrochemical baths in plating technology | Robin Cheung, Daniel Carl, Liang-Yuh Chen, Yezdi Dordi, Paul Smith +2 more | 2005-05-17 |
| 6890850 | Method of depositing dielectric materials in damascene applications | Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more | 2005-05-10 |
| 6849545 | System and method to form a composite film stack utilizing sequential deposition techniques | Alfred Mak, Mei Chang, Jeong Soo Byun, Hua Chung, Moris Kori | 2005-02-01 |
| 6829056 | Monitoring dimensions of features at different locations in the processing of substrates | Michael Barnes, John D. Holland, II, Hongqing Shan, Bryan Pu, Mohit Jain +5 more | 2004-12-07 |
| 6787006 | Operating a magnetron sputter reactor in two modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +1 more | 2004-09-07 |
| 6635157 | Electro-chemical deposition system | Yezdi Dordi, Donald Olgado, Ratson Morad, Peter Hey, Mark Denome +10 more | 2003-10-21 |
| 6551929 | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques | Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more | 2003-04-22 |
| 6503375 | Electroplating apparatus using a perforated phosphorus doped consumable anode | Dan Maydan | 2003-01-07 |
| 6485618 | Integrated copper fill process | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +2 more | 2002-11-26 |
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +1 more | 2002-09-17 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Robin Cheung, Peijun Ding +3 more | 2002-08-20 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Zheng Xu, Peijun Ding, Barry Chin | 2002-06-04 |
| 6372633 | Method and apparatus for forming metal interconnects | Dan Maydan, Zheng Xu, Liang Chen, Roderick C. Mosely, Daniel Carl +3 more | 2002-04-16 |
| 6296712 | Chemical vapor deposition hardware and process | Xin Sheng Guo, Mohan K. Bhan, Justin Jones, Lawrence Chung-Lai Lei, Russell C. Ellwanger +2 more | 2001-10-02 |
| 6290865 | Spin-rinse-drying process for electroplated semiconductor wafers | Mark Cassidy Cridlin Lloyd, Sergio Edelstein, Michael Sugarman | 2001-09-18 |
| 6277249 | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +2 more | 2001-08-21 |
| 6274008 | Integrated process for copper via filling | Praburam Gopalraja, Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu +2 more | 2001-08-14 |
| 6270621 | Etch chamber | Simon W. Tam, Semyon Sherstinsky, Mei Chang, Alan F. Morrison | 2001-08-07 |
| 6270859 | Plasma treatment of titanium nitride formed by chemical vapor deposition | Jun Zhao, Avi Tepman, Mei Chang, Lee Luo, Alex Schreiber +4 more | 2001-08-07 |
| 6258220 | Electro-chemical deposition system | Yezdi Dordi, Donald Olgado, Ratson Morad, Peter Hey, Mark Denome +10 more | 2001-07-10 |
| 6258223 | In-situ electroless copper seed layer enhancement in an electroplating system | Robin Cheung, Daniel Carl, Yezdi Dordi, Peter Hey, Ratson Morad +2 more | 2001-07-10 |
| 6189482 | High temperature, high flow rate chemical vapor deposition apparatus and related methods | Jun Zhao, Lee Luo, Xiao Liang Jin, Jia-Xiang Wang, Talex Sajoto +2 more | 2001-02-20 |