Issued Patents All Time
Showing 101–125 of 240 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770365 | Package structures and methods of forming the same | Chen-Hua Yu, Hsien-Pin Hu, Jing-Cheng Lin, Szu-Wei Lu, Wen-Hsin Wei +2 more | 2020-09-08 |
| 10746923 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang +1 more | 2020-08-18 |
| 10748870 | Tri-layer COWOS structure | Chen-Hua Yu, Yun-Han Lee | 2020-08-18 |
| 10734295 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu +1 more | 2020-08-04 |
| 10720401 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-07-21 |
| 10665474 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shin-Puu Jeng | 2020-05-26 |
| 10663512 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2020-05-26 |
| 10656351 | Package structure for optical fiber and method for forming the same | Sung-Hui Huang, Jui Hsieh Lai | 2020-05-19 |
| 10535633 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Hsien-Pin Hu | 2020-01-14 |
| 10529679 | 3D packages and methods for forming the same | Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-01-07 |
| 10515888 | Semiconductor device and method for manufacturing the same | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin +1 more | 2019-12-24 |
| 10515906 | Forming large chips through stitching | Wen-Hsin Wei, Hsien-Pin Hu, Weiming Chris Chen | 2019-12-24 |
| 10515869 | Semiconductor package structure having a multi-thermal interface material structure | Ting-Yu Yeh, Chia-Hao Hsu, Weiming Chris Chen, Kuo-Chiang Ting, Tu-Hao Yu | 2019-12-24 |
| 10515829 | Package system for integrated circuits | Wei-Cheng Wu, Shin-Puu Jeng, Chen-Hua Yu | 2019-12-24 |
| 10510722 | Semiconductor device and method for manufacturing the same | Weiming Chris Chen, Tu-Hao Yu, Kuo-Chiang Ting, Chi-Hsi Wu | 2019-12-17 |
| 10510603 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Sao-Ling Chiu, Wan-Yu Lee | 2019-12-17 |
| RE47709 | Forming grounded through-silicon vias in a semiconductor substrate | Chi-Chun Hsieh, Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shin-Puu Jeng | 2019-11-05 |
| 10446520 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Wensen Hung, Szu-Po Huang | 2019-10-15 |
| 10319699 | Chip package having die structures of different heights | Wen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Weiming Chris Chen | 2019-06-11 |
| 10304800 | Packaging with substrates connected by conductive bumps | Weiming Chris Chen, Ting-Yu Yeh, Chia-Hsin Chen, Tu-Hao Yu, Kuo-Chiang Ting +1 more | 2019-05-28 |
| 10269584 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shin-Puu Jeng | 2019-04-23 |
| 10262939 | Configurable routing for packaging applications | Chung-Yu Lu, Hsien-Pin Hu, Shin-Puu Jeng, Tzuan-Horng Liu, Shih-Wen Huang +1 more | 2019-04-16 |
| 10175294 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2019-01-08 |
| 10170457 | COWOS structures and method of forming the same | Wei-Ming Chen, Tu-Hao Yu, Kuo-Chiang Ting, Chi-Hsi Wu | 2019-01-01 |
| 10163856 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2018-12-25 |