Issued Patents All Time
Showing 76–100 of 240 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183399 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-11-23 |
| 11169207 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2021-11-09 |
| 11164855 | Package structure with a heat dissipating element and method of manufacturing the same | Weiming Chris Chen, Chi-Hsi Wu, Chih-Wei Wu, Kuo-Chiang Ting, Szu-Wei Lu +3 more | 2021-11-02 |
| 11156772 | Photonic semiconductor device and method | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Pin-Tso Lin, Sung-Hui Huang +1 more | 2021-10-26 |
| 11152312 | Packages with interposers and methods for forming the same | Sao-Ling Chiu, Kuo-Ching Hsu, Wei-Cheng Wu, Ping-Kang Huang, Shin-Puu Jeng +1 more | 2021-10-19 |
| 11121118 | Integrated circuit stacking approach | Jing-Cheng Lin | 2021-09-14 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2021-08-24 |
| 11101236 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Tsung-Yu Chen, Chien-Yuan Huang | 2021-08-24 |
| 11101140 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-08-24 |
| 11081372 | Package system for integrated circuits | Wei-Cheng Wu, Shin-Puu Jeng, Chen-Hua Yu | 2021-08-03 |
| 11069657 | Chip package having die structures of different heights and method of forming same | Wen-Hsin Wei, Hsien-Pin Hu | 2021-07-20 |
| 11069539 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shin-Puu Jeng | 2021-07-20 |
| 10985137 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2021-04-20 |
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2021-04-20 |
| 10978346 | Conductive vias in semiconductor packages and methods of forming same | Sung-Hui Huang, Hung-Pin Chang, Sao-Ling Chiu, Wan-Yu Lee | 2021-04-13 |
| 10964667 | Stacked integrated circuit structure and method of forming | Wei-Ming Chen, Hsien-Pin Hu, Wen-Hsin Wei | 2021-03-30 |
| 10948668 | Package structure for optical fiber and method for forming the same | Sung-Hui Huang, Jui Hsieh Lai | 2021-03-16 |
| 10886147 | Package structure and method for forming the same | Kuan-Yu Huang, Sung-Hui Huang | 2021-01-05 |
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Yushun Lin, Heh-Chang Huang, Shu-Chia Hsu +2 more | 2020-12-22 |
| 10866373 | Optical transceiver and manufacturing method thereof | Chen-Hua Yu, Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting +1 more | 2020-12-15 |
| 10867954 | Interconnect chips | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2020-12-15 |
| 10866374 | Optical bench on substrate and method of making the same | Ying-Hao Kuo, Wan-Yu Lee | 2020-12-15 |
| 10854567 | 3D packages and methods for forming the same | Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2020-12-01 |
| 10847485 | Chip package structure and method for forming the same | Kuan-Yu Huang, Sung-Hui Huang | 2020-11-24 |
| 10790254 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Yi-Wei Liu +4 more | 2020-09-29 |