Issued Patents All Time
Showing 26–50 of 240 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027455 | Chip-on-wafer structure with Chiplet Interposer | Weiming Chris Chen, Kuo-Chiang Ting | 2024-07-02 |
| 12015023 | Integrated circuit package and method of forming same | Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang +8 more | 2024-06-18 |
| 12002721 | Method of fabricating semiconductor structure | Kuan-Yu Huang, Sung-Hui Huang, Chien-Yuan Huang | 2024-06-04 |
| 11996371 | Chiplet interposer | Weiming Chris Chen, Kuo-Chiang Ting, Hsien-Pin Hu, Wen-Chih Chiou, Chen-Hua Yu | 2024-05-28 |
| 11990443 | Semiconductor die package and method of manufacture | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Yu-Yun Huang, Wen-Yao Chang +1 more | 2024-05-21 |
| 11978714 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Tu-Hao Yu, Chia-Hao Hsu, Ting-Yu Yeh | 2024-05-07 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2024-04-23 |
| 11916009 | Semiconductor package and manufacturing method thereof | Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu | 2024-02-27 |
| 11852868 | Photonic semiconductor device and method of manufacture | Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Chi-Hsi Wu | 2023-12-26 |
| 11854983 | Semiconductor devices and methods of manufacture | Hsien-Pin Hu | 2023-12-26 |
| 11848304 | Semiconductor device and method of forming the same | Jiun Yi Wu, Chen-Hua Yu | 2023-12-19 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Hsien-Pin Hu, Kuo-Ching Hsu, Shin-Puu Jeng | 2023-11-28 |
| 11810793 | Semiconductor packages and methods of forming same | Chung-Yu Lu, Ping-Kang Huang, Sao-Ling Chiu | 2023-11-07 |
| 11764123 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu +1 more | 2023-09-19 |
| 11747563 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Chen-Hua Yu, Kuo-Chiang Ting | 2023-09-05 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2023-08-15 |
| 11705407 | Package structure and fabricating method thereof | Kuan-Yu Huang, Sung-Hui Huang | 2023-07-18 |
| 11699674 | Semiconductor package and method of forming the same | Kuan-Yu Huang, Li-Chung Kuo, Sung-Hui Huang, Tsung-Yu Chen, Chien-Yuan Huang | 2023-07-11 |
| 11694939 | Semiconductor package, integrated optical communication system | Sung-Hui Huang, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu +1 more | 2023-07-04 |
| 11682593 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Hsien-Pin Hu, Tzu-Yu Wang, Wei-Cheng Wu +1 more | 2023-06-20 |
| 11630271 | Package structure | Sung-Hui Huang, Jui Hsieh Lai | 2023-04-18 |
| 11592618 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Chen-Hua Yu, Kuo-Chiang Ting | 2023-02-28 |
| 11569172 | Semiconductor devices and methods of manufacture | Hsien-Pin Hu | 2023-01-31 |
| 11569156 | Semiconductor device, electronic device including the same, and manufacturing method thereof | Kuan-Yu Huang, Sung-Hui Huang | 2023-01-31 |
| 11552054 | Package structure and method of manufacturing the same | Wei-Ting Lin, Ping-Kang Huang, Sao-Ling Chiu | 2023-01-10 |