Issued Patents All Time
Showing 426–450 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9112049 | Metal bump joint structure and methods of forming | — | 2015-08-18 |
| 9111914 | Fan out package, semiconductor device and manufacturing method thereof | Jui-Pin Hung, Po-Hao Tsai | 2015-08-18 |
| 9099515 | Reconfigurable guide pin design for centering wafers having different sizes | Hsin Chang, Hsin-Yu Chen, Fang Wen Tsai, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2015-08-04 |
| 9093314 | Copper bump structures having sidewall protection layers | Ya-Hsi Hwung, Hsin-Yu Chen, Po-Hao Tsai, Yan-Fu Lin, Cheng-Lin Huang +2 more | 2015-07-28 |
| 9087821 | Hybrid bonding with through substrate via (TSV) | — | 2015-07-21 |
| 9064879 | Packaging methods and structures using a die attach film | Jui-Pin Hung, Nai-Wei Liu, Chin-Chuan Chang, Chen-Hua Yu, Shin-Puu Jeng +3 more | 2015-06-23 |
| 9048222 | Method of fabricating interconnect structure for package-on-package devices | Jui-Pin Hung, Po-Hao Tsai, Yi-Jou Lin, Shuo-Mao Chen, Chiung-Han Yeh +1 more | 2015-06-02 |
| 9040382 | Selective epitaxial growth of semiconductor materials with reduced defects | Chen-Hua Yu | 2015-05-26 |
| 9041225 | Integrated circuit structure having dies with connectors | Cheng-Lin Huang | 2015-05-26 |
| 9024438 | Self-aligning conductive bump structure and method of making the same | Cheng-Lin Huang, I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Szu-Wei Lu +2 more | 2015-05-05 |
| 9023266 | Semiconductor molding chamber | Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2015-05-05 |
| 9006004 | Probing chips during package formation | Szu-Wei Lu | 2015-04-14 |
| 9000584 | Packaged semiconductor device with a molding compound and a method of forming the same | Jui-Pin Hung, Nai-Wei Liu, Yi-Chao Mao, Wan-Ting Shih, Tsan-Hua Tung | 2015-04-07 |
| 8994171 | Method and apparatus for a conductive pillar structure | Jung-Hua Chang, Cheng-Lin Huang, Nai-Wei Liu, Jui-Pin Hung | 2015-03-31 |
| 8980741 | Through silicon via with embedded barrier pad | Yung-Chi Lin, Sylvia Lo, Yen-Hung Chen, Wen-Chih Chiou | 2015-03-17 |
| 8975183 | Process for forming semiconductor structure | — | 2015-03-10 |
| 8970035 | Bump structures for semiconductor package | Po-Hao Tsai | 2015-03-03 |
| 8962392 | Underfill curing method using carrier | Chin-Fu Kao, Jui-Pin Hung, Szu-Wei Lu | 2015-02-24 |
| 8963334 | Die-to-die gap control for semiconductor structure and method | Szu-Wei Lu, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee +2 more | 2015-02-24 |
| 8963317 | Thermal dissipation through seal rings in 3DIC structure | — | 2015-02-24 |
| 8956966 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu | 2015-02-17 |
| 8953336 | Surface metal wiring structure for an IC substrate | Chin-Fu Kao, Wen-Chih Chiou, Cheng-Lin Huang, Po-Hao Tsai | 2015-02-10 |
| 8952544 | Semiconductor device and manufacturing method thereof | Jui-Pin Hung, Po-Hao Tsai | 2015-02-10 |
| 8946893 | Apparatus for dicing interposer assembly | Chung Yu Wang, Kung-Chen Yeh, Chih-Wei Wu, Szu-Wei Lu | 2015-02-03 |
| 8941244 | Semiconductor device and manufacturing method thereof | Po-Hao Tsai, Jui-Pin Hung, Long Hua Lee | 2015-01-27 |