Issued Patents All Time
Showing 401–425 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9299640 | Front-to-back bonding with through-substrate via (TSV) | — | 2016-03-29 |
| 9299594 | Substrate bonding system and method of modifying the same | Yu-Liang Lin, Weng-Jin Wu | 2016-03-29 |
| 9293369 | Three-dimensional integrated circuit (3DIC) | Chih-Wei Wu, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2016-03-22 |
| 9293366 | Through-substrate vias with improved connections | Ku-Feng Yang | 2016-03-22 |
| 9287172 | Interposer-on-glass package method | Chen-Hua Yu | 2016-03-15 |
| 9281297 | Solution for reducing poor contact in info packages | Chen-Hua Yu, Szu-Wei Lu, Shih-Ting Lin, Shin-Puu Jeng | 2016-03-08 |
| 9252065 | Mechanisms for forming package structure | Po-Hao Tsai | 2016-02-02 |
| 9245773 | Semiconductor device packaging methods and structures thereof | Szu-Wei Lu, I-Hsuan Peng | 2016-01-26 |
| 9236369 | Bonded semiconductor structures | — | 2016-01-12 |
| 9230934 | Surface treatment in electroless process for adhesion enhancement | Cheng-Lin Huang, Wei-An Tsao | 2016-01-05 |
| 9230902 | Interconnect structure for wafer level package | Chen-Hua Yu, Nai-Wei Liu, Jui-Pin Hung, Shin-Puu Jeng | 2016-01-05 |
| 9219016 | Structure design for 3DIC testing | Po-Hao Tsai | 2015-12-22 |
| 9209048 | Two step molding grinding for packaging applications | Wen-Chun Huang, Chien-Chen Li, Kuo-Chio Liu, Ruey-Yun Shiue, Hsi-Kuei Cheng +3 more | 2015-12-08 |
| 9209045 | Fan out package structure and methods of forming | Pu Wang, Ying-Ching Shih, Szu-Wei Lu | 2015-12-08 |
| 9184291 | FinFET device and method of forming fin in the same | Guobin Yu | 2015-11-10 |
| 9171815 | Method of forming package systems having interposers | Yung-Chi Lin, Chen-Hua Yu | 2015-10-27 |
| 9159687 | Solder bump for ball grid array | Jung-Hua Chang, Cheng-Lin Huang | 2015-10-13 |
| 9159589 | Bump structural designs to minimize package defects | Cheng-Lin Huang | 2015-10-13 |
| 9153506 | System and method for through silicon via yield | Chien Rhone Wang, Kewei Zuo, Chen-Hua Yu, Yen-Hsin Liu | 2015-10-06 |
| 9153462 | Spin chuck for thin wafer cleaning | Yu-Liang Lin, Weng-Jin Wu, Wen-Chih Chiou | 2015-10-06 |
| 9142432 | Integrated fan-out package structures with recesses in molding compound | Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung | 2015-09-22 |
| 9123643 | Chip-on-wafer structures and methods for forming the same | Hsin Chang, Shih-Ting Lin | 2015-09-01 |
| 9117682 | Methods of packaging semiconductor devices and structures thereof | Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung | 2015-08-25 |
| 9111912 | 3D packages and methods for forming the same | Shih-Ting Lin, Kung-Chen Yeh, Szu-Wei Lu | 2015-08-18 |
| 9111821 | Packaged semiconductor devices and packaging devices and methods | Po-Hao Tsai | 2015-08-18 |