Issued Patents All Time
Showing 451–475 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8936966 | Packaging methods for semiconductor devices | Jui-Pin Hung | 2015-01-20 |
| 8933551 | 3D-packages and methods for forming the same | Chin-Chuan Chang, Chen-Hua Yu | 2015-01-13 |
| 8927412 | Multi-chip package and method of formation | Chen-Hua Yu, Jui-Pin Hung, Der-Chyang Yeh | 2015-01-06 |
| 8928117 | Multi-chip package structure and method of forming same | Jui-Pin Hung, Chen-Hua Yu, Der-Chyang Yeh | 2015-01-06 |
| 8928159 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Wen-Chih Chiou, Shin-Puu Jeng | 2015-01-06 |
| 8922004 | Copper bump structures having sidewall protection layers | Ya-Hsi Hwung, Hsin-Yu Chen, Po-Hao Tsai, Yan-Fu Lin, Cheng-Lin Huang +2 more | 2014-12-30 |
| 8916972 | Adhesion between post-passivation interconnect structure and polymer | Jui-Pin Hung, Min-Chen Lin, Yi-Hang Lin | 2014-12-23 |
| 8901735 | Connector design for packaging integrated circuits | Chen-Hua Yu, Ying-Ching Shih, Po-Hao Tsai, Chin-Fu Kao, Cheng-Lin Huang +4 more | 2014-12-02 |
| 8896136 | Alignment mark and method of formation | Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai +4 more | 2014-11-25 |
| 8877554 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jui-Pin Hung | 2014-11-04 |
| 8871568 | Packages and method of forming the same | Ying-Ching Shih, Szu-Wei Lu | 2014-10-28 |
| 8872326 | Three dimensional (3D) fan-out packaging mechanisms | Chin-Chuan Chang, Jui-Pin Hung | 2014-10-28 |
| 8866301 | Package systems having interposers with interconnection structures | Yung-Chi Lin, Chen-Hua Yu | 2014-10-21 |
| 8860229 | Hybrid bonding with through substrate via (TSV) | — | 2014-10-14 |
| 8846524 | Plating process | Chin-Fu Kao, Cheng-Lin Huang | 2014-09-30 |
| 8847389 | Method and apparatus for a conductive bump structure | Jung-Hua Chang, Cheng-Lin Huang | 2014-09-30 |
| 8846499 | Composite carrier structure | Ying-Ching Shih, Weng-Jin Wu, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2014-09-30 |
| 8829676 | Interconnect structure for wafer level package | Chen-Hua Yu, Nai-Wei Liu, Jui-Pin Hung, Shin-Puu Jeng | 2014-09-09 |
| 8828848 | Die structure and method of fabrication thereof | Ying-Da Wang, Li-Chung Kuo, Szu-Wei Lu | 2014-09-09 |
| 8816495 | Structures and formation methods of packages with heat sinks | Chung Yu Wang, Shih-Yi Syu | 2014-08-26 |
| 8803316 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu | 2014-08-12 |
| 8803337 | Integrated circuit structure having dies with connectors | Cheng-Lin Huang | 2014-08-12 |
| 8796849 | Metal bump joint structure | — | 2014-08-05 |
| 8796758 | Selective epitaxial growth of semiconductor materials with reduced defects | Chen-Hua Yu | 2014-08-05 |
| 8796829 | Thermal dissipation through seal rings in 3DIC structure | — | 2014-08-05 |