JL

Jing-Cheng Lin

TSMC: 492 patents #9 of 12,232Top 1%
ST Sky Tech: 41 patents #1 of 15Top 7%
Micron: 6 patents #2,080 of 6,345Top 35%
S( Semiconductor Manufacturing International (Shanghai): 3 patents #213 of 1,122Top 20%
TL Tinggi Technologies Private Limited: 1 patents #4 of 10Top 40%
TC Tsann Kuen (Zhangzhou) Enterprise Co.: 1 patents #48 of 130Top 40%
DE Delta Electronics: 1 patents #1,366 of 2,746Top 50%
NT National Taiwan University Of Science And Technology: 1 patents #163 of 607Top 30%
SP Semiconductor Technologies & Instruments Pte: 1 patents #19 of 43Top 45%
Overall (All Time): #313 of 4,157,543Top 1%
549
Patents All Time

Issued Patents All Time

Showing 501–525 of 549 patents

Patent #TitleCo-InventorsDate
8540506 Semiconductor molding chamber Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu 2013-09-24
8536573 Plating process and structure Chin-Fu Kao, Cheng-Lin Huang 2013-09-17
8518753 Assembly method for three dimensional integrated circuit Chih-Wei Wu, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu 2013-08-27
8501590 Apparatus and methods for dicing interposer assembly Chung Yu Wang, Kung-Chen Yeh, Chih-Wei Wu, Szu-Wei Lu 2013-08-06
8500182 Vacuum wafer carriers for strengthening thin wafers Ku-Feng Yang, Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu 2013-08-06
8455995 TSVs with different sizes in interposers for bonding dies Po-Hao Tsai, Chen-Hua Yu 2013-06-04
8455321 Multiple-gate transistors with reverse T-shaped fins Li-Shyue Lai 2013-06-04
8426961 Embedded 3D interposer structure Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu 2013-04-23
8424449 Lifting cover type frying-roasting device Tachi Liu 2013-04-23
8411459 Interposer-on-glass package structures Chen-Hua Yu 2013-04-02
8395221 Depletion-free MOS using atomic-layer doping Chen-Hua Yu 2013-03-12
8395215 Germanium field effect transistors and fabrication thereof 2013-03-12
8361895 Ultra-shallow junctions using atomic-layer doping Chen-Hua Yu 2013-01-29
8361842 Embedded wafer-level bonding approaches Chen-Hua Yu 2013-01-29
8338939 TSV formation processes using TSV-last approach Yung-Chi Lin, Ku-Feng Yang 2012-12-25
8338945 Molded chip interposer structure and methods Chen-Hua Yu, Chun-Hui Yu 2012-12-25
8338884 Selective epitaxial growth of semiconductor materials with reduced defects Chen-Hua Yu 2012-12-25
8329556 Localized annealing during semiconductor device fabrication Shu Yuan 2012-12-11
8319349 Approach for bonding dies onto interposers Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Wen-Chih Chiou +1 more 2012-11-27
8247285 N-FET with a highly doped source/drain and strain booster Chen-Hua Yu 2012-08-21
8199540 High voltage gain power converter Ching-Shan Leu, Shun-Yuan Wu 2012-06-12
8124513 Germanium field effect transistors and fabrication thereof 2012-02-28
8105875 Approach for bonding dies onto interposers Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Wen-Chih Chiou +1 more 2012-01-31
8058692 Multiple-gate transistors with reverse T-shaped fins Li-Shyue Lai 2011-11-15
8050901 Prediction and control of NBTI of integrated circuits 2011-11-01