Issued Patents All Time
Showing 476–500 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8785299 | Package with a fan-out structure and method of forming the same | Yi-Chao Mao, Chin-Chuan Chang, Jui-Pin Hung | 2014-07-22 |
| 8779588 | Bump structures for multi-chip packaging | Chen-Hua Yu | 2014-07-15 |
| 8778738 | Packaged semiconductor devices and packaging devices and methods | Po-Hao Tsai | 2014-07-15 |
| 8779599 | Packages including active dies and dummy dies and methods for forming the same | Cheng-Lin Huang, Szu-Wei Lu, Jui-Pin Hung, Shin-Puu Jeng, Chen-Hua Yu | 2014-07-15 |
| 8772929 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh +2 more | 2014-07-08 |
| 8772945 | Through silicon via with embedded barrier pad | Yung-Chi Lin, Wen-Chih Chiou, Yen-Hung Chen, Sylvia Lo | 2014-07-08 |
| 8759150 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Wen-Chih Chiou +1 more | 2014-06-24 |
| 8759118 | Plating process and structure | Chin-Fu Kao, Cheng-Lin Huang | 2014-06-24 |
| 8749077 | Three-dimensional integrated circuit (3DIC) | Chih-Wei Wu, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2014-06-10 |
| 8722540 | Controlling defects in thin wafer handling | Yu-Liang Lin, Weng-Jin Wu | 2014-05-13 |
| 8703542 | Wafer-level packaging mechanisms | Jui-Pin Hung | 2014-04-22 |
| 8698308 | Bump structural designs to minimize package defects | Cheng-Lin Huang | 2014-04-15 |
| 8664760 | Connector design for packaging integrated circuits | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Cheng-Chieh Hsieh, Kuo-Ching Hsu +4 more | 2014-03-04 |
| 8653658 | Planarized bumps for underfill control | Po-Hao Tsai | 2014-02-18 |
| 8643148 | Chip-on-Wafer structures and methods for forming the same | Hsin Chang, Shih-Ting Lin | 2014-02-04 |
| 8629568 | Semiconductor device cover mark | Yan-Fu Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu | 2014-01-14 |
| 8610285 | 3D IC packaging structures and methods with a metal pillar | Chen-Hua Yu, Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Cheng-Chieh Hsieh +3 more | 2013-12-17 |
| 8592995 | Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump | Chen-Hua Yu | 2013-11-26 |
| 8587026 | Semiconductor device and manufacturing method thereof | Yonggen He, Huojin Tu | 2013-11-19 |
| 8580614 | Embedded wafer-level bonding approaches | Chen-Hua Yu | 2013-11-12 |
| 8580683 | Apparatus and methods for molding die on wafer interposers | Chung Yu Wang, Chih-Wei Wu, Szu-Wei Lu | 2013-11-12 |
| 8581402 | Molded chip interposer structure and methods | Chen-Hua Yu, Chun-Hui Yu | 2013-11-12 |
| 8569086 | Semiconductor device and method of dicing semiconductor devices | Chih-Wei Wu, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2013-10-29 |
| 8567837 | Reconfigurable guide pin design for centering wafers having different sizes | Hsin Chang, Hsin-Yu Chen, Fang Wen Tsai, Wen-Chih Chiou, Shin-Puu Jeng +1 more | 2013-10-29 |
| 8557684 | Three-dimensional integrated circuit (3DIC) formation process | Chih-Wei Wu, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2013-10-15 |