Issued Patents All Time
Showing 526–549 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8034709 | Method for forming composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Hsien-Ming Lee, Shing-Chyang Pan, Chao-Hsien Peng +3 more | 2011-10-11 |
| 7790535 | Depletion-free MOS using atomic-layer doping | Chen-Hua Yu | 2010-09-07 |
| 7453149 | Composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Hsien-Ming Lee, Shing-Chyang Pan, Chao-Hsien Peng +3 more | 2008-11-18 |
| 7443029 | Adhesion of copper and etch stop layer for copper alloy | Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang | 2008-10-28 |
| 7338903 | Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer | Chao-Hsien Peng, Ching-Hua Hsieh, Shau-Lin Shue | 2008-03-04 |
| 7253501 | High performance metallization cap layer | Hsien-Ming Lee, Shing-Chyang Pan, Ching-Hua Hsieh, Chao-Hsien Peng, Cheng-Lin Huang +2 more | 2007-08-07 |
| 7250683 | Method to solve via poisoning for porous low-k dielectric | Ming-Hsing Tsai, Shau-Lin Shue, Chen-Hua Yu | 2007-07-31 |
| 7226860 | Method and apparatus for fabricating metal layer | Hsien-Ming Lee, Shing-Chyang Pan, Ming-Hsing Tsai, Hung-Wen Su, Shih-Wei Chou +3 more | 2007-06-05 |
| 7215024 | Barrier-less integration with copper alloy | Cheng-Lin Huang, Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang | 2007-05-08 |
| 7202162 | Atomic layer deposition tantalum nitride layer to improve adhesion between a copper structure and overlying materials | Chao-Hsien Peng, Shau-Lin Shue, Mong-Song Liang | 2007-04-10 |
| 7193327 | Barrier structure for semiconductor devices | Chen-Hua Yu, Shing-Chyang Pan, Shau-Lin Shue, Ching-Hua Hsieh, Cheng-Lin Huang +1 more | 2007-03-20 |
| 7154178 | Multilayer diffusion barrier for copper interconnections | — | 2006-12-26 |
| 7030023 | Method for simultaneous degas and baking in copper damascene process | Shing-Chyang Pan, Ching-Hua Hsieh, Hsien-Ming Lee, Cheng-Lin Huang, Shau-Lin Shue | 2006-04-18 |
| 6969675 | Method of forming multilayer diffusion barrier for copper interconnections | — | 2005-11-29 |
| 6967155 | Adhesion of copper and etch stop layer for copper alloy | Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang | 2005-11-22 |
| 6943111 | Barrier free copper interconnect by multi-layer copper seed | Cheng-Lin Huang, Winston Shue, Mong-Song Liang | 2005-09-13 |
| 6878615 | Method to solve via poisoning for porous low-k dielectric | Ming-Hsing Tsai, Shau-Lin Shue, Chen-Hua Yu | 2005-04-12 |
| 6864670 | Method for eliminating noise interference and acoustic noise by printed circuit board ground plane layout | Jr-Hong Ouyang, Hui-Chuan Lai | 2005-03-08 |
| 6806192 | Method of barrier-less integration with copper alloy | Cheng-Lin Huang, Ching-Hua Hsieh, Shau-Lin Shue, Mong-Song Liang | 2004-10-19 |
| 6797608 | Method of forming multilayer diffusion barrier for copper interconnections | — | 2004-09-28 |
| 6706629 | Barrier-free copper interconnect | Cheng-Lin Huang, Winston Shue, Mong-Song Liang | 2004-03-16 |
| 6576543 | Method for selectively depositing diffusion barriers | Shau-Lin Shue | 2003-06-10 |
| 6551915 | Thermal annealing/hydrogen containing plasma method for forming structurally stable low contact resistance damascene conductor structure | Shau-Lin Shue | 2003-04-22 |
| 6342448 | Method of fabricating barrier adhesion to low-k dielectric layers in a copper damascene process | Shau-Lin Shue, Chen-Hua Yu | 2002-01-29 |