Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6995089 | Method to remove copper without pattern density effect | Shih-Wei Chou, Minghsing Tsai | 2006-02-07 |
| 6943111 | Barrier free copper interconnect by multi-layer copper seed | Jing-Cheng Lin, Cheng-Lin Huang, Mong-Song Liang | 2005-09-13 |
| 6793797 | Method for integrating an electrodeposition and electro-mechanical polishing process | Shih-Wei Chou, Ming-Hsing Tsai, Mong-Song Liang | 2004-09-21 |
| 6706629 | Barrier-free copper interconnect | Jing-Cheng Lin, Cheng-Lin Huang, Mong-Song Liang | 2004-03-16 |
| 6649513 | Copper back-end-of-line by electropolish | Ming-Hsing Tsai, Shih-Wei Chou, Mong-Song Liang | 2003-11-18 |
| 6627527 | Method to reduce metal silicide void formation | Maureen Wang, Chi-Wei Chang | 2003-09-30 |
| 6555474 | Method of forming a protective layer included in metal filled semiconductor features | Cheng-Lin Huang, Minghsing Tsai, Mong-Song Liang | 2003-04-29 |