Issued Patents All Time
Showing 376–400 of 549 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406598 | Package with a fan-out structure and method of forming the same | Yi-Chao Mao, Chin-Chuan Chang, Jui-Pin Hung | 2016-08-02 |
| 9406581 | Methods of packaging semiconductor devices and structures thereof | Jui-Pin Hung, Yi-Hang Lin, Tsan-Hua Tung | 2016-08-02 |
| 9390060 | Packaging methods, material dispensing methods and apparatuses, and automated measurement systems | Chien Rhone Wang, Chih-Wei Lai, Chih-Chiang Chang, Kewei Zuo | 2016-07-12 |
| 9391041 | Fan-out wafer level package structure | — | 2016-07-12 |
| 9391000 | Methods for forming silicon-based hermetic thermal solutions | Cheng-Chieh Hsieh | 2016-07-12 |
| 9378982 | Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package | Jui-Pin Hung, Li-Hui Cheng | 2016-06-28 |
| 9379041 | Fan out package structure | Feng-Cheng Hsu, Szu-Wei Lu | 2016-06-28 |
| 9379080 | Method and apparatus for a conductive pillar structure | Jung-Hua Chang, Cheng-Lin Huang, Nai-Wei Liu, Jui-Pin Hung | 2016-06-28 |
| 9373575 | TSV structures and methods for forming the same | Yung-Chi Lin, Hsin-Yu Chen, Wen-Chih Chiou, Ku-Feng Yang, Tsang-Jiuh Wu | 2016-06-21 |
| 9368438 | Package on package (PoP) bonding structures | Jui-Pin Hung, Po-Hao Tsai | 2016-06-14 |
| 9368458 | Die-on-interposer assembly with dam structure and method of manufacturing the same | Chih-Wei Wu, Szu-Wei Lu | 2016-06-14 |
| 9358660 | Grinding wheel design with elongated teeth arrangement | Chun-Hsing Su, Tsei-Chung Fu, Wen-Hua Chang, Yi-Chao Mao | 2016-06-07 |
| 9355973 | Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices | Po-Hao Tsai, Jui-Pin Hung | 2016-05-31 |
| 9355977 | Bump structures for semiconductor package | Po-Hao Tsai | 2016-05-31 |
| 9349701 | Self-aligning conductive bump structure and method of fabrication | Cheng-Lin Huang, I-Ting Chen, Ying-Ching Shih, Po-Hao Tsai, Szu-Wei Lu +2 more | 2016-05-24 |
| 9343419 | Bump structures for semiconductor package | Chen-Hua Yu, Meng-Liang Lin, Jy-Jie Gau, Cheng-Lin Huang, Kuo-Ching Hsu | 2016-05-17 |
| 9343431 | Dam structure for enhancing joint yield in bonding processes | Ying-Ching Shih, Szu-Wei Lu | 2016-05-17 |
| 9337096 | Apparatus and methods for molding die on wafer interposers | Chung Yu Wang, Chih-Wei Wu, Szu-Wei Lu | 2016-05-10 |
| 9337063 | Package for three dimensional integrated circuit | Chih-Hao Chen, Long Hua Lee, Chun-Hsing Su, Yi-Lin Tsai, Kung-Chen Yeh +2 more | 2016-05-10 |
| 9324756 | CIS chips and methods for forming the same | Chen-Hua Yu, Wen-Chih Chiou | 2016-04-26 |
| 9318455 | Method of forming a plurality of bumps on a substrate and method of forming a chip package | Po-Hao Tsai | 2016-04-19 |
| 9312149 | Method for forming chip-on-wafer assembly | Cheng-Lin Huang, Szu-Wei Lu, Jui-Pin Hung, Shin-Puu Jeng, Chen-Hua Yu | 2016-04-12 |
| 9312148 | Method of packaging a semiconductor device | Jui-Pin Hung, Nai-Wei Liu, Yi-Chao Mao, Wan-Ting Shih, Tsan-Hua Tung | 2016-04-12 |
| 9299682 | Packaging methods for semiconductor devices | Jui-Pin Hung | 2016-03-29 |
| 9299680 | Integrated circuit structure having dies with connectors | Cheng-Lin Huang | 2016-03-29 |