Issued Patents All Time
Showing 76–100 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-08-23 |
| 11415459 | Photosensor device with dark current cancellation | Chen-Hua Hsi | 2022-08-16 |
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2022-08-02 |
| 11387171 | Method of packaging a semiconductor die | Hui-Min Huang, Shou-Cheng Hu, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2022-07-12 |
| 11362089 | Gate structure with additional oxide layer and method for manufacturing the same | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2022-06-14 |
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11335717 | Semiconductor device including light-collimating layer | Chung-Ren Lao, Chih-Cherng Liao, Shih-Hao Liu, Wu-Hsi Lu, Ming-Cheng Lo +1 more | 2022-05-17 |
| 11324899 | Nebulizer | Chih-Chieh Chen, Sheng-Hsiu Huang, Yu-Mei Kuo, Wei-Ren Ke | 2022-05-10 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-05-03 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2022-02-15 |
| 11239103 | Package-on-package structure | Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-02-01 |
| 11239082 | Method for fabricating semiconductor device | I-Fan Chang, Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, Jie-Ning Yang +4 more | 2022-02-01 |
| 11233039 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Yu-Hao Chen | 2022-01-25 |
| 11217708 | Optical sensor and method for forming the same | Shih-Hao Liu, Chung-Ren Lao, Chih-Cherng Liao, Wu-Hsi Lu, Ming-Cheng Lo +1 more | 2022-01-04 |
| 11217555 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu | 2022-01-04 |
| 11211780 | Cable pass-through device | Chun Chang, Hsin-Chieh Lin, Yao-Long Lin | 2021-12-28 |
| 11194990 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2021-12-07 |
| 11177237 | Manufacturing method of semiconductor package | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu | 2021-11-16 |
| 11177156 | Semiconductor package, manufacturing method of semiconductor device and semiconductor package | Sheng-Chieh Yang, Shing-Chao Chen, Ching-Hua Hsieh | 2021-11-16 |
| 11133274 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2021-09-28 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 11101714 | Brushless DC motor fan | Chin-Chun Lai, Seng-En Mai, Kun-Fu Chuang | 2021-08-24 |
| 11101344 | Structure and formation method of semiconductor device structure with gate stack | Chih-Lin Wang, Kang-Min Kuo | 2021-08-24 |
| 11101261 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-08-24 |