Issued Patents All Time
Showing 26–50 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154838 | Semiconductor arrangement and method of forming | Ming-Hsien Lin, Ming-Hong Hsieh, Jian-Hong Lin | 2024-11-26 |
| 12148792 | Structure and formation method of semiconductor device structure with gate stack | Chih-Lin Wang, Kang-Min Kuo | 2024-11-19 |
| 12125797 | Package structure with fan-out feature | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2024-10-22 |
| 12107051 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2024-10-01 |
| 12080653 | Formation method of chip package with fan-out structure | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2024-09-03 |
| 12057359 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu | 2024-08-06 |
| 12040293 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chun-Chih Lin | 2024-07-16 |
| 12033992 | Package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Sheng-Chieh Yang | 2024-07-09 |
| 12033965 | Semiconductor device and method of forming the same | Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai | 2024-07-09 |
| 12021037 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2024-06-25 |
| 12011859 | Molding apparatus and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2024-06-18 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2024-06-11 |
| 12009345 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2024-06-11 |
| 11991853 | Cable clip | Chao-Jung Chen, Jui-Chung Lee, Hui-Ying Suk | 2024-05-21 |
| 11988246 | Axial-rotation locking-mechanism assembly | Chao-Jung Chen, Che-Hung Lin | 2024-05-21 |
| 11961791 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2024-04-16 |
| 11935804 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2024-03-19 |
| 11901319 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2024-02-13 |
| 11901258 | Iintegrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2024-02-13 |
| 11855006 | Memory device, package structure and fabricating method thereof | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2023-12-26 |
| 11854789 | Method for manufacturing gate structure with additional oxide layer | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2023-12-26 |
| 11848300 | Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor wafer | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2023-12-19 |
| 11837550 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2023-12-05 |
| 11804434 | Integrated circuit apparatus and power distribution network thereof | Chan-Wei Hsu, Yun-Chih Chang | 2023-10-31 |
| 11776838 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Shing-Chao Chen, Ching-Hua Hsieh | 2023-10-03 |