Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12180576 | PVD target design and semiconductor devices formed using the same | Chia-Hsi Wang, Yen-Yu Chen, Yi-Chih Chen | 2024-12-31 |
| 12142664 | Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrode | Han-Wen Liao, Xuan-You Yan, Yen-Yu Chen, Chun-Chih Lin | 2024-11-12 |
| 12125783 | Interconnect structure and method for forming the same | Chung-Liang Cheng, Yen-Yu Chen | 2024-10-22 |
| 12040293 | Redistribution layer metallic structure and method | Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2024-07-16 |
| 11725270 | PVD target design and semiconductor devices formed using the same | Chia-Hsi Wang, Yen-Yu Chen, Yi-Chih Chen | 2023-08-15 |
| 11664308 | Interconnect structure and method of forming the same | Chung-Liang Cheng, Yen-Yu Chen | 2023-05-30 |
| 11502050 | Redistribution layer metallic structure and method | Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2022-11-15 |
| 11177365 | Semiconductor device with adhesion layer | Chun-Chih Lin, Yen-Yu Chen | 2021-11-16 |
| 11164957 | Semiconductor device with adhesion layer and method of making | Chun-Chih Lin, Yen-Yu Chen | 2021-11-02 |
| 11081341 | Apparatus for fabricating a semiconductor device with target sputtering and target sputtering method for fabricating the semiconductor device | Yen-Yu Chen, Yi-Ming Dai | 2021-08-03 |
| 10923416 | Interconnect structure with insulation layer and method of forming the same | Chung-Liang Cheng, Yen-Yu Chen | 2021-02-16 |
| 10916517 | Redistribution layer metallic structure and method | Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2021-02-09 |
| 10658315 | Redistribution layer metallic structure and method | Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin, Chun-Chih Lin | 2020-05-19 |
| 10490649 | Method of fabricating semiconductor device with adhesion layer | Chun-Chih Lin, Yen-Yu Chen | 2019-11-26 |
| 10446662 | Reducing metal gate overhang by forming a top-wide bottom-narrow dummy gate electrode | Han-Wen Liao, Xuan-You Yan, Yen-Yu Chen, Chun-Chih Lin | 2019-10-15 |
| 10354965 | Bonding pad process with protective layer | Chun-Chih Lin, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin, Wen-Hao Cheng | 2019-07-16 |
| 9803274 | Process kit of physical vapor deposition chamber and fabricating method thereof | Wei-Jen Chen, Yen-Yu Chen, Hsien-Chieh Hsiao, Chang-Sheng Lee, Wei-Chen Liao +1 more | 2017-10-31 |