Issued Patents All Time
Showing 101–125 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088124 | Package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Sheng-Chieh Yang | 2021-08-10 |
| 11079814 | Mechanism for securing an add-in module in a computer device | Chao-Jung Chen | 2021-08-03 |
| 11075131 | Semiconductor package and method of forming the same | Yi-Da Tsai, Ching-Hua Hsieh, Tsai-Tsung Tsai, Sheng-Chieh Yang, Chia-Min Lin | 2021-07-27 |
| 11075179 | Semiconductor device and method of forming the same | Wen-Hao Cheng, Yen-Yu Chen, Yi-Ming Dai | 2021-07-27 |
| 11031376 | Chip package and method of forming the same | Hsaing-Pin Kuan, Ching-Hua Hsieh, Ching-Yao Lin, Chun-Yen Lan, Kai-Ming Chiang | 2021-06-08 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2021-04-20 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10973149 | Streamlined air baffle for electronic device | Chao-Jung Chen, Yu-Nien Huang, Herman TAN | 2021-04-06 |
| 10964641 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2021-03-30 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2021-03-16 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2021-03-16 |
| 10947417 | Thermal-curable adhesive composition and adhesive sheet | Chun-Ting Lai | 2021-03-16 |
| 10937872 | Semiconductor structures | Li-Che Chen, Chien-Hsien Song, Hung-Chih Tan | 2021-03-02 |
| 10916517 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chun-Chih Lin | 2021-02-09 |
| 10879192 | Semiconductor structure and manufacturing method thereof | Hsaing-Pin Kuan, Ching-Hua Hsieh, Chun-Cheng Lin, Yu-Wei Lin, Chun-Yen Lan | 2020-12-29 |
| 10879203 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10867953 | Manufacturing method of integrated fan-out package | Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Ching-Yao Lin | 2020-12-15 |
| 10867932 | Method for manufacturing package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-12-15 |
| 10861692 | Substrate carrier deterioration detection and repair | Jen-Ti Wang, Fu-Hsien Li, Yi-Ming Chen, Cheng-Ho Hung | 2020-12-08 |
| 10861827 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2020-12-08 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2020-11-10 |
| 10818614 | Package structure | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Hao-Cheng Hou, Jung Wei Cheng | 2020-10-27 |
| 10750644 | Rear side swappable fan array module design | Chao-Jung Chen, Ming-Lun Ku | 2020-08-18 |
| 10700025 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2020-06-30 |