Issued Patents All Time
Showing 126–150 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658315 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chun-Chih Lin | 2020-05-19 |
| 10642319 | Flexible stacked up chassis | Chao-Jung Chen, Ming-Lun Ku | 2020-05-05 |
| 10636873 | Method of fabricating semiconductor device | Tsung-Han Lin, Chao-Wei Wu, Yen-Kai Chen | 2020-04-28 |
| 10636715 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu | 2020-04-28 |
| 10629508 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2020-04-21 |
| 10622240 | Package on-package structure | Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2020-04-14 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2020-03-24 |
| 10566261 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2020-02-18 |
| 10535609 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2020-01-14 |
| 10522652 | Method for fabricating semiconductor device with reduced wafer edge defects | Po-Wen Su, Wei-Chih Lai, Tai-Yen Lin | 2019-12-31 |
| 10522543 | Method for manufacturing gate structure with additional oxide layer | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2019-12-31 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chun-Cheng Lin, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-31 |
| 10516314 | Slim reel-type brushless motor and insulation seat thereof | Sheng-En Mai, Kun-Fu Chuang | 2019-12-24 |
| 10515900 | Chip package with fan-out structure | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2019-12-24 |
| 10510709 | Semicondcutor package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu | 2019-12-17 |
| 10510697 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2019-12-17 |
| 10510644 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2019-12-17 |
| 10510630 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-12-17 |
| 10504858 | Package structure and method of fabricating the same | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Hao-Cheng Hou, Jung Wei Cheng | 2019-12-10 |
| 10487922 | Horizontal motion mechanism in limited space | Chao-Jung Chen, Chih-Hsiang Lee, Chia-Wei Huang | 2019-11-26 |
| 10470333 | Flexible chassis for different sized sleds | Chao-Jung Chen, Ming-Lun Ku | 2019-11-05 |
| 10468493 | Method for manufacturing gate stack structure | Chun-Ting Chiang, Chi-Ju Lee, Bo SU, Yen-Liang Wu, Wen-Tsung Chang +2 more | 2019-11-05 |
| 10439022 | Structure and formation method of semiconductor device structure with gate stack | Chih-Lin Wang, Kang-Min Kuo | 2019-10-08 |
| 10412851 | Inclined storage array for improved cooling | Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen | 2019-09-10 |