Issued Patents All Time
Showing 176–200 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043802 | Gate structure with additional oxide layer | Chih-Lin Wang, Kang-Min Kuo, Cheng-Wei Lian | 2018-08-07 |
| 10032734 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2018-07-24 |
| 10014260 | Package structure and method for forming the same | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-07-03 |
| 10015902 | Integrated moveable and lockable rail | Chao-Jung Chen, Chien-Wei Huang | 2018-07-03 |
| 9991190 | Packaging with interposer frame | Hui-Min Huang, Yen-Chang Hu, Ming-Da Cheng, Chung-Shi Liu, Chen-Shien Chen | 2018-06-05 |
| 9982041 | Compositions and methods for treatment and detection of cancers | Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Shih-Chi Yeh, Chung-Yi Wu +1 more | 2018-05-29 |
| 9975965 | Compositions and methods for treatment and detection of cancers | Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Shih-Chi Yeh, Chung-Yi Wu +1 more | 2018-05-22 |
| 9978716 | Package structure and method for manufacturing the same | Chih-Chiang Tsao, Hsiu-Jen Lin, Chun-Cheng Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2018-05-22 |
| 9958912 | Two rack unit chassis and low profile tool-less hard drive carrier | Chao-Jung Chen, Yaw-Tzorng Tsorng, Chih-Hsiang Lee, Chun Chang, Chia-Wei Huang | 2018-05-01 |
| 9960246 | Semiconductor structure with insertion layer and method for manufacturing the same | Cheng-Wei Lian, Chih-Lin Wang, Kang-Min Kuo | 2018-05-01 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2018-04-17 |
| 9935091 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-04-03 |
| 9914841 | Polyimide film incorporating a colored polyimide matting power and manufacture thereof | Wu-Yung Yang | 2018-03-13 |
| 9911675 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9911674 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2018-03-06 |
| 9899248 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Hung-Jui Kuo, Ming-Da Cheng, Yu-Hsiang Hu | 2018-02-20 |
| 9898645 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2018-02-20 |
| 9892962 | Wafer level chip scale package interconnects and methods of manufacture thereof | Cheng-Tar Wu, Chung-Shi Liu, Hui-Min Huang, Chun-Cheng Lin, Ming-Da Cheng | 2018-02-13 |
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2018-01-30 |
| 9876069 | High-voltage semiconductor device and method for manufacturing the same | Pao-Hao Chiu, Keng-Yu Lin | 2018-01-23 |
| 9866060 | Apparatus for performing hybrid power control in an electronic device to allow charging using any of high power adaptors corresponding to different voltages | Nien-Hui Kung, Yen-Hsun Hsu | 2018-01-09 |
| 9865574 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-09 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Meng-Tse Chen, Wei-Hung Lin +3 more | 2018-01-02 |
| 9850401 | Multilayered polyimide film having a low dielectric constant, laminate structure including the same and manufacture thereof | Chung-Ting Lai | 2017-12-26 |
| 9837487 | Structure and formation method of semiconductor device structure with gate stack | Chih-Lin Wang, Kang-Min Kuo | 2017-12-05 |