Issued Patents All Time
Showing 201–225 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786622 | Semiconductor package | Ming-Da Cheng, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Chung-Shi Liu | 2017-10-10 |
| 9768137 | Stud bump structure for semiconductor package assemblies | Meng-Tse Chen, Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9768048 | Package on-package structure | Hui-Min Huang, Ai-Tee Ang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9691708 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng +1 more | 2017-06-27 |
| 9679836 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chen-Shien Chen, Chih-Hua Chen, Chen-Cheng Kuo | 2017-06-13 |
| 9666572 | Process for forming package-on-package structures | Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2017-05-30 |
| 9660073 | High-voltage semiconductor device and method for manufacturing the same | Pi-Kuang Chuang, Chao-Wei Wu | 2017-05-23 |
| 9627234 | Method and apparatus for localized and controlled removal of material from a substrate | Hui-Min Huang, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9607921 | Package on package interconnect structure | Wen-Hsiung Lu, Yi-Wen Wu, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-03-28 |
| 9598772 | Method for fabricating bump structure without UBM undercut | Ming-Da Cheng, Wen-Hsiung Lu, Chung-Shi Liu | 2017-03-21 |
| 9576830 | Method and apparatus for adjusting wafer warpage | Hui-Min Huang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |
| 9550886 | Stabilizer and composition including the same | Chiung-Ta Chen, Ming-Yang Chien, En-Ching Wang, Chien-Liang Liu | 2017-01-24 |
| 9543185 | Packaging process tools and systems, and packaging methods for semiconductor devices | Wei-Hung Lin, Kuei-Wei Huang, Chun-Cheng Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-01-10 |
| 9515158 | Semiconductor structure with insertion layer and method for manufacturing the same | Cheng-Wei Lian, Chih-Lin Wang, Kang-Min Kuo | 2016-12-06 |
| 9484285 | Interconnect structures for wafer level package and methods of forming same | Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-11-01 |
| 9462725 | Server rack and its server device | Maw-Zan Jau, Chao-Jung Chen, Yaw-Tzorng Tsorng | 2016-10-04 |
| 9449908 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-09-20 |
| 9425178 | RDL-first packaging process | Shing-Chao Chen, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-08-23 |
| 9418978 | Method of forming package-on-package (PoP) structure having a chip package with a plurality of dies attaching to first side of an interposer with a die formed thereon | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Ming-Da Cheng | 2016-08-16 |
| 9412723 | Package on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9406345 | Horizontal coupling of vertically-oriented hard drive | Wei Yang, Chao-Jung Chen | 2016-08-02 |
| 9401337 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-07-26 |
| 9373610 | Process for forming package-on-package structures | Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2016-06-21 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2016-06-14 |
| 9343386 | Alignment in the packaging of integrated circuits | Kuei-Wei Huang, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-05-17 |