Issued Patents All Time
Showing 251–275 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8884431 | Packaging methods and structures for semiconductor devices | Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang, Chung-Shi Liu +7 more | 2014-11-11 |
| 8843860 | Frame cell for shot layout flexibility | Chin-Ming Lin, Chia-Hung Huang, Chi-Ming Yang, Chin-Hsiang Lin, Yung-Cheng Chen | 2014-09-23 |
| 8837772 | Image detecting method and system thereof | Tsann-Tay Tang, Ming-Yu Shih | 2014-09-16 |
| 8809117 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Kuei-Wei Huang, Chun-Cheng Lin +1 more | 2014-08-19 |
| 8803234 | High voltage semiconductor device and method for fabricating the same | Chih-Cherng Liao, Yun Wei, Pi-Kuang Chuang, Ching-Yi Hsu, Wen-Chung Chen +5 more | 2014-08-12 |
| 8755054 | Method of measuring surface structure of display device | Min Wang, Yung-Cheng Chen, Hung-Min Liu | 2014-06-17 |
| 8735273 | Forming wafer-level chip scale package structures with reduced number of seed layers | Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Hsiu-Jen Lin, Chung-Shi Liu +2 more | 2014-05-27 |
| 8703546 | Activation treatments in plating processes | Ming-Da Cheng, Ming-Che Ho, Chung-Shi Liu | 2014-04-22 |
| 8659155 | Mechanisms for forming copper pillar bumps | Ming-Da Cheng, Wen-Hsiung Lu, Ching-Wen Chen, Yi-Wen Wu, Chia-Tung Chang +2 more | 2014-02-25 |
| 8605235 | Display device and method of measuring surface structure thereof | Min Wang, Yung-Cheng Chen, Hung-Min Liu | 2013-12-10 |
| 8586408 | Contact and method of formation | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Chih-Chun Chiu, Ming-Da Cheng +1 more | 2013-11-19 |
| 8581401 | Mechanisms for forming copper pillar bumps using patterned anodes | Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2013-11-12 |
| 8570010 | Multiphase power supply device and current adjusting method thereof | Nung-Te Huang, Chih-Wan Hsu | 2013-10-29 |
| 8546254 | Mechanisms for forming copper pillar bumps using patterned anodes | Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2013-10-01 |
| 8501610 | Non-volatile memories and methods of fabrication thereof | Yi Fang Lee, Cheng-Ta Wu, Cheng-Yuan Tsai | 2013-08-06 |
| 8501615 | Metal bump formation | Ming-Da Cheng, Hsiu-Jen Lin, Tzong-Hann Yang, Wen-Hsiung Lu, Zheng-Yi Lim +2 more | 2013-08-06 |
| 8492891 | Cu pillar bump with electrolytic metal sidewall protection | Wen-Hsiung Lu, Ming-Da Cheng, Jacky Chang, Chung-Shi Liu, Chen-Hua Yu | 2013-07-23 |
| 8440503 | Methods for performing reflow in bonding processes | Hsiu-Jen Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2013-05-14 |
| 8405199 | Conductive pillar for semiconductor substrate and method of manufacture | Wen-Hsiung Lu, Ming-Da Cheng, Ming-Che Ho, Chung-Shi Liu | 2013-03-26 |
| 8304923 | Chip packaging structure | Dyi-Chung Hu, Yu-Shan Hu | 2012-11-06 |
| 8264213 | Variable-frequency and multi-phase voltage regulator module and control method of the same | Nung-Te Huang, Chih-Wan Hsu | 2012-09-11 |
| 8242011 | Method of forming metal pillar | Zheng-Yi Lim, Yi-Wen Wu, Wen-Hsiung Lu, Tzong-Huann Yang, Hsiu-Jen Lin +2 more | 2012-08-14 |
| 8239788 | Frame cell for shot layout flexibility | Yung-Cheng Chen, Heng-Jen Lee | 2012-08-07 |
| 8214664 | Power supply system and power supplying control method | Chih-Wan Hsu, Nung-Te Huang | 2012-07-03 |
| 7956375 | Light emitting diode structure having a textured package lens | Yueh-Han Li, Po-Tang Hsu, Chien-Ming Ko, Hung-Ching Lee | 2011-06-07 |