Issued Patents All Time
Showing 276–283 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7883240 | Light emitting diode based light source assembly | Pei-Chin Lee, Hung-Kuang Hsu | 2011-02-08 |
| 7876963 | Symbol recognition method | Ming-Hung Lin | 2011-01-25 |
| 7655501 | Wafer level package with good CTE performance | Wen-Kun Yang, Tung-Chuan Wang, Chao-Nan Chou | 2010-02-02 |
| 7453148 | Structure of dielectric layers in built-up layers of wafer level package | Wen-Kun Yang, Chun-Hui Yu, Chao-Nan Chou, Ching-Shun Huang | 2008-11-18 |
| 7353077 | Methods for optimizing die placement | Hong-Hsing Chou, Yeh-Jye Wang, Chen-Fu Chien, Jen-Hsin Wang, Chih-Wei Hsiao | 2008-04-01 |
| 7338140 | Computer housing | Yuh-Wen Huang, I-Ching Chou, Chun-Liang Li | 2008-03-04 |
| 7224061 | Package structure | Wen-Kun Yang, Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou | 2007-05-29 |
| 6969189 | LED backlight module | Liu-Chung Lee | 2005-11-29 |