Issued Patents All Time
Showing 226–250 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2016-05-03 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Meng-Tse Chen, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-04-12 |
| 9287203 | Package-on-package structure and method of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Wei-Yu Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-03-15 |
| 9284424 | Polyimide film and fabrication method thereof | Meng-Ying Tsai | 2016-03-15 |
| 9267057 | Polyimide film incorporating polyimide powder delustrant, and manufacture thereof | Chung-Yi Chen, Chi-Huan LO, Shihan Tai | 2016-02-23 |
| 9269687 | Packaging methods and packaged semiconductor devices | Meng-Tse Chen, Wei-Hung Lin, Yu-Peng Tsai, Chun-Cheng Lin, Ming-Da Cheng +1 more | 2016-02-23 |
| 9263595 | Non-volatile memories and methods of fabrication thereof | Yi Fang Lee, Cheng-Ta Wu, Cheng-Yuan Tsai | 2016-02-16 |
| 9252135 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2016-02-02 |
| 9218999 | Packaging process tools and packaging methods for semiconductor devices | Wen-Hsiung Lu, Ming-Da Cheng, Wei-Hung Lin, Kuei-Wei Huang, Chun-Cheng Lin +1 more | 2015-12-22 |
| 9139713 | Stabilizer and composition including the same | Chiung-Ta Chen, Ming-Yang Chien, En-Ching Wang, Chien-Liang Liu | 2015-09-22 |
| 9123763 | Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core material | Chen-Hua Yu, Chung-Shi Liu, Mirng-Ji Lii, Ming-Da Cheng | 2015-09-01 |
| 9117816 | Process for forming package-on-package structures | Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2015-08-25 |
| 9082636 | Packaging methods and structures for semiconductor devices | Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen, Chen-Hua Yu +7 more | 2015-07-14 |
| 9070667 | Peripheral electrical connection of package on package | Ching-Wen Hsiao, Wei Sen Chang, Yen-Chang Hu, Kuo Lung Pan, Yu-Chih Huang | 2015-06-30 |
| 9059148 | Contact structure | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Chih-Chun Chiu, Ming-Da Cheng +1 more | 2015-06-16 |
| 9006097 | Cu pillar bump with electrolytic metal sidewall protection | Wen-Hsiung Lu, Ming-Da Cheng, Jacky Chang, Chung-Shi Liu, Chen-Hua Yu | 2015-04-14 |
| 8987915 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Chang-Chia Huang, Ming-Da Cheng | 2015-03-24 |
| 8975741 | Process for forming package-on-package structures | Ming-Da Cheng, Meng-Tse Chen, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2015-03-10 |
| D723353 | Lock | — | 2015-03-03 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang +6 more | 2015-01-06 |
| D719813 | Lock | — | 2014-12-23 |
| D719815 | Lock | — | 2014-12-23 |
| D719816 | Lock | — | 2014-12-23 |
| D719814 | Lock | — | 2014-12-23 |
| 8906599 | Enhanced scanner throughput system and method | Yu-Mei Liu, Chin-Hsiang Lin, Heng-Hsin Liu, Heng-Jen Lee, I-Hsiung Huang | 2014-12-09 |