Issued Patents All Time
Showing 151–175 of 283 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388749 | Manufacturing method of semiconductor device | Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, I-Fan Chang, Chun-Ting Chiang +2 more | 2019-08-20 |
| 10390454 | Vertical adjustable cable management arm | Chao-Jung Chen, Chih-Hsiang Lee, Wei Yang | 2019-08-20 |
| 10385176 | Transparent polyimide composite film for flexible display and method for manufacturing the same | Chun-Ting Lai | 2019-08-20 |
| 10373941 | Package-on-package structures and methods for forming the same | Kuei-Wei Huang, Hsiu-Jen Lin, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2019-08-06 |
| 10366896 | Semiconductor device and method for fabricating the same | I-Fan Chang, Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, Jie-Ning Yang +4 more | 2019-07-30 |
| 10354965 | Bonding pad process with protective layer | Shih Wei Bih, Chun-Chih Lin, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng | 2019-07-16 |
| 10325853 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2019-06-18 |
| 10286029 | Method for treating HCV | Walid M. Awni, Barry M. Bernstein, Andrew L. Campbell, Sandeep Dutta, Wei Liu +4 more | 2019-05-14 |
| 10283470 | Semiconductor package and manufacturing method thereof | Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu, Meng-Tse Chen +2 more | 2019-05-07 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Meng-Tse Chen, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Hsiang Chiu, Yao-Tong Lai | 2019-05-07 |
| 10283427 | Molding structure for wafer level package | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-05-07 |
| 10276541 | 3D package structure and methods of forming same | Meng-Tse Chen, Chung-Shi Liu, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2019-04-30 |
| 10276537 | Integrated fan-out package and manufacturing method thereof | Ai-Tee Ang, Shing-Chao Chen, Ching-Hua Hsieh, Ching-Yao Lin | 2019-04-30 |
| 10269673 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Wei-Hung Lin, Ming-Da Cheng | 2019-04-23 |
| 10268872 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2019-04-23 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Meng-Tse Chen, Wei-Hung Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2019-01-29 |
| 10186594 | Semiconductor device having metal gate | Chun-Ting Chiang, Chi-Ju Lee, Bo SU, Yen-Liang Wu, Wen-Tsung Chang +2 more | 2019-01-22 |
| 10170573 | Semiconductor device and fabrication method thereof | Chun-Ting Chiang, Jie-Ning Yang, Chi-Ju Lee, Bo SU, Yen-Liang Wu +3 more | 2019-01-01 |
| 10157846 | Method for forming chip package involving cutting process | Shing-Chao Chen, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2018-12-18 |
| 10150818 | Compositions and methods for treatment and detection of cancers | Chi-Huey Wong, Tsui-Ling Hsu, Yi-Wei Lou, Shih-Chi Yeh, Chung-Yi Wu +1 more | 2018-12-11 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng +6 more | 2018-11-20 |
| 10128193 | Package structure and method for forming the same | Shing-Chao Chen, Ching-Yao Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2018-11-13 |
| 10128206 | Conductive pillar structure | Ming-Da Cheng, Wen-Hsiung Lu, Meng-Wei Chou, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-13 |
| 10062764 | Semiconductor device having void between gate electrode and sidewall spacer and manufacturing method thereof | Yen-Liang Wu, Wen-Tsung Chang, Jui-Ming Yang, I-Fan Chang, Chun-Ting Chiang +2 more | 2018-08-28 |
| 10040939 | Polyimide film having a low dielectric constant and a low gloss, and method of fabricating the same | Chun-Ting Lai | 2018-08-07 |