Issued Patents All Time
Showing 1,276–1,300 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9576929 | Multi-strike process for bonding | Tung-Liang Shao, Chih-Hang Tung, Wen-Lin Shih, Hsiao-Yun Chen | 2017-02-21 |
| 9576926 | Pad structure design in fan-out package | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2017-02-21 |
| 9570324 | Method of manufacturing package system | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng | 2017-02-14 |
| 9570366 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Tzuan-Horng Liu, Tzu-Wei Chiu +1 more | 2017-02-14 |
| 9564420 | Functional block stacked 3DIC and method of making same | Kuo-Chung Yee, Chih-Hang Tung | 2017-02-07 |
| 9558966 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Hsien-Wei Chen, Chi-Hsi Wu, Der-Chyang Yeh, Wei-Cheng Wu, Chien-Fu Tseng | 2017-01-31 |
| 9553000 | Interconnect structure for wafer level package | Jing-Cheng Lin, Nai-Wei Liu, Jui-Pin Hung, Shin-Puu Jeng | 2017-01-24 |
| 9553070 | 3D packages and methods for forming the same | Der-Chyang Yeh | 2017-01-24 |
| 9548274 | Reticle for non-rectangular die | Ming-Fa Chen, Sung-Feng Yeh | 2017-01-17 |
| 9543170 | Semiconductor packages and methods of forming the same | Jing-Cheng Lin, Po-Hao Tsai | 2017-01-10 |
| 9536850 | Package having substrate with embedded metal trace overlapped by landing pad | Mirng-Ji Lii, Chen-Shien Chen, Yu-Jen Tseng | 2017-01-03 |
| 9536818 | Semiconductor package and method of forming the same | Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu, Mirng-Ji Lii | 2017-01-03 |
| 9536811 | Semiconductor die contact structure and method | Chung-Shi Liu | 2017-01-03 |
| 9537205 | 3D antenna for integrated circuits | Jeng-Shieh Hsieh, Chung-Hao Tsai, Chuei-Tang Wang | 2017-01-03 |
| 9530759 | 3D package with through substrate vias | Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Chao-Wen Shih, Tsung-Yuan Yu +1 more | 2016-12-27 |
| 9530715 | Thermally enhanced structure for multi-chip device | Chih-Hang Tung, Tung-Liang Shao | 2016-12-27 |
| 9530762 | Semiconductor package, semiconductor device and method of forming the same | Chung-Shi Liu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2016-12-27 |
| 9530757 | Single mask package apparatus | Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo | 2016-12-27 |
| 9524959 | System on integrated chips and methods of forming same | Sung-Feng Yeh, Ming-Fa Chen | 2016-12-20 |
| 9524942 | Chip-on-substrate packaging on carrier | Tzu-Shiun Sheu, Shin-Puu Jeng, Shih-Peng Tai, An-Jhih Su, Chi-Hsi Wu | 2016-12-20 |
| 9524956 | Integrated fan-out structure and method | Hao-Jan Pei, Hui-Min Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-12-20 |
| 9520340 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2016-12-13 |
| 9521795 | Two-step direct bonding processes and tools for performing the same | Yi-Li Hsiao, Da-Yuan Shih, Chih-Hang Tung | 2016-12-13 |
| 9515036 | Methods and apparatus for solder connections | Hao-Yi Tsai, Chien-Hsiun Lee, Chung-Shi Liu, Hsien-Wei Chen | 2016-12-06 |
| 9508666 | Packaging structures and methods with a metal pillar | Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Cheng-Chieh Hsieh, Ying-Ching Shih +3 more | 2016-11-29 |