Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356955 | Pet excrement collecting device capable of closing excrement collecting bag | Chunyun Li, Xiuqi Li | 2025-07-15 |
| 12336197 | In-plane inductors in IC packages | Brandon C. Marin, Tarek A. Ibrahim, Prithwish Chatterjee, Haifa Hariri, Sheng Li +1 more | 2025-06-17 |
| 12322721 | Asymmetric Stackup Structure for SoC package substrates | Taegui Kim, Yifan Kao, Jun Chung Hsu | 2025-06-03 |
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Kyu Oh Lee, Zhichao Zhang, Liwei Cheng, Andrew J. Brown +2 more | 2025-04-29 |
| 11955426 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Amruthavalli Pallavi Alur | 2024-04-09 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Wei-Lun Kane Jen +6 more | 2024-03-05 |
| 11862597 | Asymmetric stackup structure for SoC package substrates | Taegui Kim, Yifan Kao, Jun Chung Hsu | 2024-01-02 |
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Junnan Zhao, Andrew J. Brown, Cheng Xu, Kaladhar Radhakrishnan | 2023-11-28 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Andrew J. Brown | 2023-09-26 |
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more | 2023-07-18 |
| 11696407 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Junnan Zhao, Cheng Xu | 2023-07-04 |
| 11651885 | Magnetic core inductors | Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Sheng Li | 2023-05-16 |
| 11646254 | Electronic device including a lateral trace | Ying Wang, Cheng Xu, Chong Zhang, Junnan Zhao | 2023-05-09 |
| 11608564 | Helical plated through-hole package inductor | William J. Lambert, Mihir K. Roy, Mathew J. Manusharow | 2023-03-21 |
| D977208 | Litter box | — | 2023-01-31 |
| 11521914 | Microelectronic assemblies having a cooling channel | Zhimin Wan, Cheng Xu, Junnan Zhao, Ying Wang, Chong Zhang +3 more | 2022-12-06 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Cheng Xu, Zhimin Wan, Lingtao Liu, Junnan Zhao, Chandra Mohan Jha +1 more | 2022-11-15 |
| 11495555 | Magnetic bilayer structure for a cored or coreless semiconductor package | Jonathan L. Rosch, Andrew J. Brown, Junnan Zhao | 2022-11-08 |
| 11482471 | Thermal management solutions for integrated circuit packages | Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Chong Zhang +3 more | 2022-10-25 |
| 11444042 | Magnetic structures in integrated circuit packages | Andrew J. Brown, Ying Wang, Chong Zhang, Lauren A. Link | 2022-09-13 |
| 11404364 | Multi-layer embedded magnetic inductor coil | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Amruthavalli Pallavi Alur | 2022-08-02 |
| 11393751 | Package-integrated multi-turn coil embedded in a package magnetic core | Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Amruthavalli Pallavi Alur | 2022-07-19 |
| 11387224 | Phase change material in substrate cavity | Cheng Xu, Zhimin Wan, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more | 2022-07-12 |
| 11380609 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Cheng Xu, Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Zhichao Zhang +2 more | 2022-07-05 |
| 11328968 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more | 2022-05-10 |