Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8337735 | Solder mold plates used in packaging process and method of manufacturing solder mold plates | — | 2012-12-25 |
| 8132775 | Solder mold plates used in packaging process and method of manufacturing solder mold plates | — | 2012-03-13 |
| 8107800 | Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing | Raschid J. Bezama, Donald R. Wall | 2012-01-31 |
| 7566649 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2009-07-28 |
| 7518235 | Method and structure to provide balanced mechanical loading of devices in compressively loaded environments | Patrick A. Coico, David L. Edwards, Benjamin V. Fasano, Ellyn M. Ingalls, Michael S. June +2 more | 2009-04-14 |
| 7443026 | IC chip package having force-adjustable member between stiffener and printed circuit board | Jeffrey A. Zitz | 2008-10-28 |
| 7332821 | Compressible films surrounding solder connectors | William E. Bernier, Tien-Jen Cheng, Marie Cole, David E. Eichstadt, Mukta G. Farooq +4 more | 2008-02-19 |
| 7095614 | Electronic module assembly | — | 2006-08-22 |
| 6955543 | Method and apparatus to form a reworkable seal on an electronic module | Gaetano P. Messina, Patrick A. Coico, Richard F. Indyk, Vladimir Jambrih, Jeffrey A. Zitz | 2005-10-18 |
| 6858111 | Conductive polymer interconnection configurations | Charles H. Perry, Mark G. Courtney, Gregory B. Martin | 2005-02-22 |
| 6724203 | Full wafer test configuration using memory metals | Chandrika Prasad | 2004-04-20 |
| 6678949 | Process for forming a multi-level thin-film electronic packaging structure | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2004-01-20 |
| 6462271 | Capping structure for electronics package undergoing compressive socket actuation | Jeffrey T. Coffin, Michael J. Ellsworth, Jr., John G. Torok | 2002-10-08 |
| 6459160 | Package with low stress hermetic seal | Eric D. Perfecto, Raed A. Sherif, William F. Shutler, Hilton T. Toy | 2002-10-01 |
| 6458623 | Conductive adhesive interconnection with insulating polymer carrier | Mario J. Interrante, Raymond A. Jackson, Amy B. Ostrander, Charles H. Perry, Brenda Peterson | 2002-10-01 |
| 6342407 | Low stress hermetic seal | Eric D. Perfecto, Raed A. Sherif, William F. Shutler, Hilton T. Toy | 2002-01-29 |
| 6333104 | Conductive polymer interconnection configurations | Charles H. Perry, Mark G. Courtney, Gregory B. Martin | 2001-12-25 |
| 6333563 | Electrical interconnection package and method thereof | Raymond A. Jackson, Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Mukta S. Farooq +3 more | 2001-12-25 |
| 6333209 | One step method for curing and joining BGA solder balls | Patrick A. Coico, James H. Covell, Kimberly A. Kelly | 2001-12-25 |
| 6287126 | Mechanical attachment means used as electrical connection | Michael Berger, Harvey C. Hamel, Mario J. Interrante, Marlene W. Moyer, Thomas P. Moyer +1 more | 2001-09-11 |
| 6281452 | Multi-level thin-film electronic packaging structure and related method | Chandrika Prasad, Roy Yu, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri +6 more | 2001-08-28 |
| 6278184 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Raymond A. Jackson, William E. Sablinski +3 more | 2001-08-21 |
| 6258191 | Method and materials for increasing the strength of crystalline ceramic | Benjamin V. Fasano, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal, Srinivasa S. N. Reddy | 2001-07-10 |
| 6253986 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Raymond A. Jackson, William E. Sablinski +3 more | 2001-07-03 |
| 6070321 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Raymond A. Jackson, William E. Sablinski +3 more | 2000-06-06 |